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Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries

机译：微米级无源金刚石层在集成电路和微机电系统行业中的应用

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摘要

The deposition of passive diamond layers of thickness comparable to 1 μm directly withinintegrated electronic and optoelectronic circuits and microelectromechanical systems promises toimprove their figures of merit, in particular those influenced by heat conduction. This application ofdiamond poses major challenges for deposition research, yet offers important thermal designadvantages over the more common application of thick diamond plates in electronic packages. Thismanuscript reviews research on using micron-scale passive diamond layers in microfabricated circuitsand sensors and predicts the impact of these layers on temperature fields and figures of merit. Thepredictions benefit from a review of thermal conductivity and boundary resistance studies formicron-scale diamond layers, with a focus on those fabricated using temperatures and nucleationmethods that promise compatibility with VLSI technology.
机译：直接在集成的电子和光电电路以及微机电系统中沉积厚度可媲美1μm的无源金刚石层有望改善其品质因数，特别是受热传导影响的品质因数。金刚石的这种应用对沉积研究提出了重大挑战，但是与较厚的金刚石板在电子封装中更普遍的应用相比，它提供了重要的热设计优势。该手稿回顾了在微型电路和传感器中使用微米级无源金刚石层的研究，并预测了这些层对温度场和品质因数的影响。该预测得益于对微米级金刚石层的热导率和边界电阻研究的回顾，重点是那些使用与VLSI技术兼容的温度和成核方法制造的金刚石。

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