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首页> 外文期刊>Journal of Applied Polymer Science >New film-forming aromatic poly(amide-imide)s containing isoindoloquinazolinedione unit in the backbone. 2. Physical properties of the film cast from poly(biphenylphthalicdianhydride-oxydianiline-4,4 '-diamino-3 '-carbamoyl-benzanilide) [poly(BPDA-ODA
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New film-forming aromatic poly(amide-imide)s containing isoindoloquinazolinedione unit in the backbone. 2. Physical properties of the film cast from poly(biphenylphthalicdianhydride-oxydianiline-4,4 '-diamino-3 '-carbamoyl-benzanilide) [poly(BPDA-ODA

机译：骨架中含有异吲哚并喹唑啉二酮单元的新型成膜芳族聚酰胺酰胺。 2.由聚（联苯邻苯二甲酸二酐-氧二苯胺-4,4'-二氨基-3'-氨基甲酰基-苯甲腈）[聚​​（BPDA-ODA）

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摘要

New aromatic poly(amide-imide) films containing isoindoloquinazolinedione unit in the backbone chain were directly obtained by thermal cyclization of the prepolymer of poly(amic acid-carbonamide) type, i.e., poly(biphenylphthalic dianhydride-oxydianiline-4,4'-diamino-3'-carbamoyl-benzanilide) [poly(BPDA-ODA-DACB)]. The films, before heat treatment, exhibited the tensile strength of 30 approximate to 40 MPa and the tensile modulus of 1.3 approximate to 1.9 GPa. After heat treatment, the strength and modulus increased to 135 approximate to 150 MPa and 2.6 approximate to 2.7 GPa, respectively. The films remained transparent throughout the thermal treatment. The cyclized films were much more chemically resistant to alkali than the commercial products such as "Kapton" film and "P84" film, while thermal properties were comparable. Toe isoindoloquinazolinedione unit induced in the chain backbone on the heat treatment of the films was considered to be a major factor responsible for the superior physical properties of the films. (C) 2000 John Wiley & Sons, Inc. [References: 25]
机译：通过热环化聚酰胺酸-碳酰胺类型的预聚物，即聚（联苯基邻苯二甲酸二酐-氧二苯胺-4,4'-二氨基），直接获得在主链中含有异吲哚并喹唑啉二酮单元的新型芳香族聚酰胺酰胺膜。 -3'-氨基甲酰基-苯甲腈）[聚​​（BPDA-ODA-DACB）]。在热处理之前，膜表现出的拉伸强度为30，约40 MPa，拉伸模量为1.3，约1.9 GPa。热处理后，强度和模量分别增加到135（约150 MPa）和2.6（约2.7 GPa）。膜在整个热处理过程中保持透明。环化膜比诸如“ Kapton”膜和“ P84”膜之类的商业产品对碱的化学耐受性要好得多，而热性能却相当。薄膜热处理中在链主链上诱导的趾异吲哚并喹唑啉二酮单元被认为是导致薄膜优异物理性能的主要因素。 （C）2000 John Wiley＆Sons，Inc. [参考：25]

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