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首页> 外文期刊>Journal of Applied Polymer Science >Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4 '-diaminodiphenylmethane
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Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4 '-diaminodiphenylmethane

机译：双酚S环氧树脂与4,4'-二氨基二苯甲烷的固化和玻璃化转变温度

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摘要

The curing reaction of bisphenol S epoxy resin (BPSER) with 4,4'-diaminodiphenylmethane (DDM) was studied by means of torsional braid analysis (TBA) in the temperature range of 393-433 K. The glass transition temperature (T-g) of the BPSER/DDM system is determined, and the results show that the reaction rate increases with increasing the T-g in terms of the rate constant, but decreases with increasing conversion.(1) The T-g of BPSER/DDM is about 40 K higher than BPAER/DDM. The gelation and vitrification time were assigned by the isothermal TEA under 373 K; in addition, an FTIR spectrum was carried out to describe the change of the molecular structure. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of the BPSER/DDM has n-order reaction kinetics.(2) (C) 2000 John Wiley & Sons, Inc. [References: 16]
机译：在393-433 K的温度范围内，通过扭转编织分析（TBA）研究了双酚S环氧树脂（BPSER）与4,4'-二氨基二苯甲烷（DDM）的固化反应。确定了BPSER / DDM体系，结果表明反应速率随速率常数的增加而随Tg的增加而增加，但随转化率的增加而降低。（1）BPSER / DDM的Tg比BPAER高约40 K / DDM。凝胶化和玻璃化时间由等温TEA在373 K下指定;另外，用FTIR光谱描述了分子结构的变化。通过热重分析（TGA）研究了该系统的热降解动力学。它表明BPSER / DDM的热降解具有n阶反应动力学。（2）（C）2000 John Wiley＆Sons，Inc. [参考：16]

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