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首页> 外文期刊>Journal of Applied Polymer Science >The development of controllable complex curing agents for epoxy resins. II. Examining the dissociation and thermal behavior of transition metal-diamine complex-epoxy blends
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The development of controllable complex curing agents for epoxy resins. II. Examining the dissociation and thermal behavior of transition metal-diamine complex-epoxy blends

机译：环氧树脂可控复合固化剂的开发。二。检查过渡金属-二胺配合物-环氧共混物的解离和热行为

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A series of complexes incorporating diamine (o-phenylene diamine and 2-aminobenzylamine) ligands and containing the acetato and chloro salts of Ni(II) and Cu(II) was incorporated into two commercial epoxy resins recognized as industry standards (MY721 and M-Y750). The cure properties of the complexes are assessed alongside commercial curative systems. Thermal analysis (principally differential scanning calorimetry) shows that the nature of the cure mechanism can be dramatically affected by the nature of the transition metal and counterion (and the level of curing agent incorporation). For example, by using a nickel(II) acetato complex rather than its chloro analog, the onset of the cure reaction of MY721 may be reduced by 40 K. Thermogravimetric analysis, and visible, infrared, and electron spin resonance spectroscopy are employed to determine the point at which the complexes undergo dissociation. The data show that Cu(2-ABA)(2)(ac)(2) appear to dissociate at temperatures between 70 and 80degreesC in octan-1-ol. A multivariate approach is applied to the analysis of infrared data obtained for solvated complex samples subjected to a heating program and the results are consistent with the dissociation temperature obtained from the other spectral data. The data suggest that the aromatic amino function in the complex undergoes dissociation from the metal at a lower temperature than the aliphatic amine. The 2-ABA-based complexes containing chloride counterions undergo gelation at higher temperatures than their acetato analogs (for both commercial epoxy systems). The newly prepared complexes generally display eta(min) values comparable with the commercial curative systems [the exceptions being Cu(2-ABA)(2)Cl-2 and Ni(OPD)(3)Cl-2, which produce markedly higher values of 14 and 10 P, respectively], but it is believed that this is due to agglomeration and settling of the complex as the resin viscosity decreases during the heating cycle. (C) 2002 Wiley Periodicals, Inc. [References: 13]
机译：将包含二胺（邻苯二胺和2-氨基苄基胺）配体并包含Ni（II）和Cu（II）的乙酸盐和氯盐的一系列配合物掺入两种公认的工业标准环氧树脂中（MY721和M- Y750）。配合商用固化体系评估复合物的固化性能。热分析（主要是差示扫描量热法）表明，固化机理的性质会受到过渡金属和抗衡离子的性质（以及固化剂掺入水平）的显着影响。例如，通过使用乙酰乙酸镍（II）络合物而不是其氯类似物，MY721的固化反应开始时间可减少40K。使用热重分析以及可见光，红外和电子自旋共振光谱确定复合物解离的点。数据表明，在octan-1-ol中，Cu（2-ABA）（2）（ac）（2）在70到80摄氏度之间似乎解离。将多元方法应用于对加热程序进行溶剂化的复杂样品获得的红外数据进行分析，结果与从其他光谱数据获得的解离温度一致。数据表明，在比脂族胺更低的温度下，络合物中的芳族氨基官能团会从金属上解离。含有氯离子抗衡剂的基于2-ABA的配合物在比其乙酰乙酸酯类似物更高的温度下发生凝胶化（对于两种商业环氧体系）。新制备的配合物通常显示出与商业固化体系相当的eta（最小）值[Cu（2-ABA）（2）Cl-2和Ni（OPD）（3）Cl-2例外，它们的值明显更高。分别为14和10 P]]，但是据信这是由于在加热循环中树脂粘度降低时配合物的附聚和沉降。 （C）2002 Wiley Periodicals，Inc. [参考：13]

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