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首页> 外文期刊>Journal of Electronic Materials >Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate
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Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

机译：ENIG基板上倒装芯片LED焊点的微观结构演变和剪切行为

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摘要

The microstructure evolution and shear behavior of the solder joints for the flip-chip light-emitting diode on the electroless nickel/immersion gold (ENIG) substrate were investigated in this study. The experimental results reveal that the solder joints for the anode and cathode have different microstructures and failure characteristics during the shear test before and after isothermal aging. For the solder joints for the anode, the interfacial intermetallic compound (IMC) is (Au, Ni)Sn-4 at the solder/anode interface but dendritic Ni3Sn4 grains at the solder/ENIG interface after reflow. Meanwhile, the dendritic Ni3Sn4 grains are surrounded by (Au, Ni)Sn-4, which suppresses the growth of the Ni3Sn4 grains during aging. For the solder joints for the cathode, a nano scaled Au-rich layer can be observed near the cathode/solder layer interface after reflow. And the Au-rich layer moves toward the bulk solder because of the volume expansion by the transformation from Au into (Au, Ni)Sn-4 during reflow and isothermal aging. Due to the diffusion of the Au atom from the Au-rich layer into the bulk solder, the Au-rich layer transformed into an interface inside of the solder joint. The average shear force of the solder joints shows a decrease from 380 gf to 250 gf because of the microstructure evolution during the isothermal aging for 1000 h at 85A degrees C. After long time aging, the primary failure mode of the solder joint for the anode changed from the anode broken to the brittle failure of the solder layer. The delamination between the IMC layer and the insulation layer is suggested to be the dominated failure mode of the solder joint for the cathode after aging.
机译：研究了化学镀镍/沉金（ENIG）衬底上倒装芯片发光二极管焊点的微观结构演变和剪切行为。实验结果表明，在等温老化前后的剪切试验中，阳极和阴极的焊点具有不同的微观结构和破坏特性。对于阳极的焊点，回流后，界面金属间化合物（IMC）在焊料/阳极界面处为（Au，Ni）Sn-4，但在焊料/ ENIG界面处为树枝状Ni3Sn4晶粒。同时，枝状Ni 3 Sn 4晶粒被（Au，Ni）Sn 4包围，这抑制了Ni 3 Sn 4晶粒在时效过程中的生长。对于用于阴极的焊点，在回流之后可以在阴极/焊料层界面附近观察到纳米级的富金层。由于在回流和等温老化过程中从Au转变为（Au，Ni）Sn-4引起的体积膨胀，富金层向块状焊料移动。由于Au原子从富Au层扩散到块状焊料中，富Au层转变成焊点内部的界面。焊点的平均剪切力从380 gf下降到250 gf，这是由于在85A摄氏度的等温老化1000 h期间组织的演变所致。长时间老化后，阳极焊点的主要失效模式从阳极断裂变为焊料层的脆性破坏。建议IMC层和绝缘层之间的分层是老化后用于阴极的焊点的主要失效模式。

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