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首页> 外文期刊>Journal of Failure Analysis and Prevention >Computed-Tomography-Based Analysis of Voids in SnBi57Agl Solder Joints and Their Influence on the Reliability
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Computed-Tomography-Based Analysis of Voids in SnBi57Agl Solder Joints and Their Influence on the Reliability

机译：基于计算机断层扫描的SnBi57Agl焊点空隙及其对可靠性的影响

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The first area of research in this article focuses on the characterization of solder joints that contain voids by means of computed tomography (CT). This non-destructive test method made it possible to detect both cracks and voids in solder joints, to define their precise positions, and to capture the void volume of each void. In addition to CT, we carried out metallographic examinations so that we could demonstrate the interaction of both methods. In the process, CT was used to localize the defect and metallography to display the defect in high resolution. The article goes on to discuss the question of whether voids have an effect on the thermo-mechanical reliability of SnBi57Agl solder joints. For this purpose, the solder joints were first classified by their void area ratio using radioscopy. In order to analyze the effect of the void area ratio on the reliability of the joint, the assembly underwent an accelerated aging process through thermal shock testing according to IPC 9701. Subsequently, the shocked assemblies were sheared. With the shear values after 1000 cycles, we were able to show that the voids affect the reliability of the SnBi57Agl solder joints only slightly and that the joints were hardly damaged. By means of CT examinations performed prior to the thermal shocks, cracks starting from the meniscus tip could be attributed to the temperature changes. These cracks may be crucial when they occur with cracks found on macrovoids inside the meniscus.
机译：本文的第一个研究领域集中于通过计算机断层扫描（CT）表征包含空洞的焊点。这种无损检测方法可以检测焊点中的裂缝和空隙，确定其精确位置，并捕获每个空隙的空隙体积。除了CT之外，我们还进行了金相检查，以证明这两种方法的相互作用。在此过程中，使用CT定位缺陷并进行金相分析以高分辨率显示缺陷。本文继续讨论空隙是否对SnBi57Agl焊点的热机械可靠性产生影响的问题。为此，首先使用射线照相术根据焊点的空隙率对焊点进行分类。为了分析空隙率对接头可靠性的影响，根据IPC 9701通过热冲击测试对组件进行了加速时效处理。随后，剪切了冲击的组件。通过1000次循环后的剪切值，我们能够证明空隙仅轻微影响SnBi57Agl焊点的可靠性，并且焊点几乎不会损坏。通过在热冲击之前进行的CT检查，从弯月面尖端开始的裂纹可能归因于温度变化。当这些裂纹与在弯月面内部的大孔隙中发现的裂纹一起发生时，这些裂纹可能至关重要。

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