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首页> 外文期刊>Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena >Electrical and Thermal Properties of Platinum Thin Films Prepared by DC Magnetron Sputtering for Micro-Heater of Microsensor Applications after CMP Process
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Electrical and Thermal Properties of Platinum Thin Films Prepared by DC Magnetron Sputtering for Micro-Heater of Microsensor Applications after CMP Process

机译：直流磁控溅射法制备的微传感器用微加热器用直流磁控溅射铂薄膜的电学和热学性能

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Chemical mechanical polishing (CMP) of platinum thin films was performed for the improvement of surface morphology. Platinum thin films after CMP process with alumina slurry showed the increase of surface morphology without a remarkable difference of the thermal characteristics of as-annealed platinum thin films. The power consumption of platinum thin films micro-heater also became very low by improvement of surface morphology after CMP process. The similar or improved electrical and thermal characteristics of platinum thin films for micro-heater of sensor applications as well as evaluation possibility of sensing property by the improved surface morphology were obtained after CMP process.
机译：为了改善表面形态，对铂薄膜进行了化学机械抛光（CMP）。用氧化铝浆料进行CMP处理后的铂薄膜显示出表面形态的增加，而退火后的铂薄膜的热特性没有显着差异。通过CMP工艺后表面形态的改善，铂薄膜微加热器的功耗也非常低。在CMP处理之后，获得了用于传感器应用的微型加热器的铂薄膜的相似或改进的电和热特性，以及通过改进的表面形态来评估感测性能的可能性。

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