...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Electromagnetic Waves and Applications >3D package-integrated artificial magnetic conductor antenna arrays for 60GHz transceivers
【24h】

3D package-integrated artificial magnetic conductor antenna arrays for 60GHz transceivers

机译：用于60GHz收发器的3D封装集成人工磁导体天线阵列

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

We present a low-profile design of dipole antenna arrays integrated on a planar artificial magnetic conductor (AMC) based on spiral unit cells. The whole system is designed and manufactured on a multi-layer organic laminate packaging technology and can be integrated with a single-chip 60-GHz radio transceiver die. We analyze two fabricated arrays of different total area both of which contain 16 elements fed through a combiner network exciting the array elements either in phase or for 45 degrees scan angle. The integrated antenna-AMC array element presented has twice the impedance bandwidth necessary to cover all international 60-GHz radio bands, small form factor suitable for on-package integration, and 5 dBi gain including all losses. The larger 16-element array, occupying 11x11mm(2) package area, has a measured gain of 17 dBi at broadside and 15dBi at 45 degrees scan angle, while the smaller array, occupying a 6.6x11mm(2) package area, has a gain of 15dBi at broadside and 14 dBi at a 45 degrees scan angle. These arrays are an ideal 3D-integrated package solution for 60GHz radio transceivers.
机译：我们提出了一个低调的偶极天线阵列设计，该阵列集成在基于螺旋晶胞的平面人工磁导体（AMC）上。整个系统采用多层有机层压封装技术设计和制造，可以与单芯片60 GHz无线收发器芯片集成在一起。我们分析了两个总面积不同的预制阵列，每个阵列都包含16个通过组合器网络馈入的元件，这些阵列以同相或45度扫描角激励阵列元件。所展示的集成天线-AMC阵列元件具有覆盖所有国际60 GHz无线电频段所需带宽的两倍的阻抗带宽，适合封装上集成的小外形尺寸以及包括所有损耗在内的5 dBi增益。较大的16元素阵列占据11x11mm（2）封装面积，在宽边处测得的增益为17 dBi，在45度扫描角下具有15dBi的测量增益，而较小的阵列则占据6.6x11mm（2）封装面积，具有增益在宽边为15dBi，在45度扫描角处为14 dBi。这些阵列是用于60GHz无线电收发器的理想3D集成封装解决方案。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号