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首页> 外文期刊>Journal of Materials Science >Vickers hardness and deformation of Ni/Cu nano-multilayers electrodeposited on copper substrates
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Vickers hardness and deformation of Ni/Cu nano-multilayers electrodeposited on copper substrates

机译：电沉积在铜基板上的Ni / Cu纳米多层膜的维氏硬度和变形

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Ni/Cu nano-multilayers were fabricated by an electrodeposition technique. Ratio of the Ni:Cu layer thickness was kept at 1:1. By laminating nickel and copper layers at a very narrow spacing, we obtained highly-densified parallel interfaces which can give rise to high strength. Dependence of Vickers hardness and tensile deformation on individual layer thickness h was investigated on the Ni/Cu multilayers. The Vickers hardness increased with decreasing layer thickness for the multilayers of h >= 10 nm. This change in the hardness was consistent with the Hall-Petch relation. At the 10 nm layer thickness, the hardness attained more than three times higher than that of the copper substrate. On the other hand, the hardness decreased rapidly with the layer thickness at h < 10 nm. The tensile deformation tests were also carried out at the substrates coated with the multilayer of h = 5, 20 and 100 nm. The SEM observations revealed that the slip lines of the deformed substrates were terminated by the multilayer at the multilayers of h = 20 and 100 nm. On the other hand, a lot of slip lines penetrated into the multilayer of h = 5 nm. These slip observations were compatible with the layer thickness dependence of the hardness. (c) 2005 Springer Science + Business Media, Inc.
机译：通过电沉积技术制备了Ni / Cu纳米多层。 Ni∶Cu层厚度之比保持在1∶1。通过以非常窄的间距层压镍和铜层，我们获得了高度致密的平行界面，可以提高强度。在Ni / Cu多层膜上研究了维氏硬度和拉伸变形对各个层厚度h的依赖性。对于h> = 10 nm的多层，维氏硬度随层厚度的减小而增加。硬度的这种变化与霍尔-帕奇关系一致。在10 nm的层厚下，其硬度是铜基板的三倍以上。另一方面，在h <10 nm时，硬度随层厚度迅速降低。还对涂覆有h = 5、20和100 nm多层的基材进行了拉伸变形测试。 SEM观察表明，变形的基材的滑移线在h ＝ 20和100nm的多层处被多层终止。另一方面，许多滑移线穿透到h = 5 nm的多层中。这些滑动观察结果与硬度对层厚度的依赖性是相容的。 （c）2005年Springer Science + Business Media，Inc.

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