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首页> 外文期刊>Journal of Materials Chemistry, C. materials for optical and electronic devices >Incompletely condensed POSS-based spin-on-glass networks for impeccable ultra low-k integration
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Incompletely condensed POSS-based spin-on-glass networks for impeccable ultra low-k integration

机译：不完全压缩的基于POSS的旋转玻璃网络，无可挑剔的超低k集成

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摘要

Poly(methyl) silsesquioxane-based spin-on-glass resins incorporating both a cyclic precursor, 1,3,5,7-tetramethyl 1,3,5,7-tetrahydroxyl cyclosiloxane, and incompletely condensed methyl-substituted POSS were synthesized and their thermal, mechanical, and electrical properties were investigated as a function of the POSS loading content. By introducing incompletely condensed methyl-substituted POSS compounds at the molecular level as sol-gel precursors, exceptional thermal stability (4700 degrees C), good mechanical properties (elastic modulus >4.0 GPa), and an ultra-low dielectric constant (k = 1.8) were obtained. In addition to providing a new route towards fully poly(methyl) silsesquioxane-based spin-on-glass resins with the above properties, the realization of the application of integration circuits was evaluated to show that the ultra low-k, mechanically robust spin-on-glass materials were able to withstand harsh wet chemical and dry etching, as well as chemical mechanical planarization (CMP) processing.
机译：合成了同时包含环状前体1,3,5,7-四甲基1,3,5,7-四羟基环硅氧烷和不完全缩合的甲基取代的POSS的基于聚（甲基）倍半硅氧烷的旋涂玻璃树脂，并对其进行了合成研究了热，机械和电性能与POSS含量的关系。通过在分子水平上引入不完全缩合的甲基取代的POSS化合物作为溶胶-凝胶前体，具有出色的热稳定性（4700摄氏度），良好的机械性能（弹性模量> 4.0 GPa）和超低介电常数（k = 1.8） ）。除了提供一条具有上述特性的完全基于聚（甲基）倍半硅氧烷的旋涂玻璃树脂的新途径外，还对积分电路的应用实现进行了评估，以显示超低k机械强度高的旋涂树脂。玻璃上的材料能够承受苛刻的湿法化学和干法蚀刻以及化学机械平面化（CMP）处理。

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