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首页> 外文期刊>Journal of Materials Engineering and Performance >Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples
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Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples

机译：焊料厚度对共晶SnPb焊料反应对中电迁移行为的影响

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摘要

The trend of miniaturization of electronic products induced the shrinking dimension of interconnects in the chip. When those interconnects are subjected to high current density (usually 10~3 to 10~4 A/cm~2), electro-migration (EM) could affect the reliability of the chip which would ultimately break the circuit. In this study, eutectic SnPb solders with thickness of 280, 128, and 50 μm were investigated under high current density (10~4 A/cm~2) and high ambient temperature (120 ℃). The EM-induced surface undulations were more prominent at the shorter thickness, demonstrating that the diffusion of metal atoms/ions was controlled by the actual temperature in the bulk solder instead of the back stress. Bamboo groove features were observed on the surface of solder extrusion at the anode side for the three solder thickness, which indicated the metal atoms/ions that migrated parallel to the direction of flow of electrons.
机译：电子产品小型化的趋势引起了芯片中互连尺寸的缩小。当这些互连经受高电流密度（通常为10〜3至10〜4 A / cm〜2）时，电迁移（EM）可能会影响芯片的可靠性，最终会破坏电路。在这项研究中，研究了在高电流密度（10〜4 A / cm〜2）和高环境温度（120℃）下厚度分别为280、128和50μm的SnPb共晶焊料。 EM引起的表面起伏在更短的厚度下更加明显，这表明金属原子/离子的扩散受散装焊料中的实际温度控制，而不是受到背应力的控制。对于三种焊料厚度，在阳极侧的焊料挤压表面上观察到竹槽特征，这表明金属原子/离子平行于电子流动方向迁移。

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