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Easy and Large Scale Synthesis Silver Nanodendrites: Highly Effective Filler for Isotropic Conductive Adhesives

机译:易于大规模合成的银纳米树突:各向同性导电胶的高效填料

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摘要

Dendritic silver (Ag) nanoparticles have been successfully prepared by an easy and large scale liquid-phase reduction method. Transmission electron microscope (TEM), scanning electron microscope (SEM), and x-ray diffraction (XRD) have shown that the Ag particles prepared by this method are pure and with uniform dendritic morphology. The bulk resistivity and bonding strength of isotropic conductive adhesives (ICAs) filled with Ag nanodendrite and micrometer-sized Ag have been measured. The results show that the dendritic morphology of Ag nanoparticles has a strong effect for improving the reinforcement of the composite electrical performance. ICA filled with small amounts of Ag nanodendrites exhibits lower bulk resistivity and higher bonding strength than ICA filled with micrometer-sized Ag. When ICA is filled with 50 wt.% micrometer-sized Ag and 10 wt.% Ag nanodendrites, the bulk resistivity is 1.3 × 10~(-4) Ω cm, and the bonding strength reaches 18.9 MPa.
机译:树突状银(Ag)纳米粒子已通过一种简单且大规模的液相还原方法成功制备。透射电子显微镜(TEM),扫描电子显微镜(SEM)和X射线衍射(XRD)显示,通过该方法制备的Ag颗粒是纯净的并且具有均匀的树枝状形态。测量了填充有纳米银和微米级银的各向同性导电胶(ICAs)的体电阻率和粘结强度。结果表明,Ag纳米颗粒的树枝状形态对改善复合电性能的增强具有很强的作用。填充有少量Ag纳米树枝晶的ICA与填充有微米级Ag的ICA相比,具有较低的体电阻率和较高的结合强度。当ICA填充有50 wt。%的微米级Ag和10 wt。%的Ag纳米树枝晶时,体电阻率为1.3×10〜(-4)Ωcm,结合强度达到18.9 MPa。

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