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首页> 外文期刊>Journal of Materials Engineering and Performance >Improved Thermal Performance of Diamond-Copper Composites with Boron Carbide Coating
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Improved Thermal Performance of Diamond-Copper Composites with Boron Carbide Coating

机译：碳化硼涂层改善金刚石-铜复合材料的热性能

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摘要

B_4C-coated diamond (diamond@B_4C) particles are used to improve the interfacial bonding and thermal properties of diamond/Cu composites. Scanning electron microscopy, x-ray diffraction, and x-ray photoelectron spectroscopy were applied to characterize the formed B_4C coating on diamond particles. It is found that the B_4C coating strongly improves the interfacial bonding between the Cu matrix and diamond particles. The resulting diamond@B_4C/Cu composites show high thermal conductivity of 665 W/mK and low coefficient of thermal expansion of 7.5 × 10~(-6)/K at 60% diamond volume fraction, which are significantly superior to those of the composites with uncoated diamond particles. The experimental thermal conductivity is also theoretically analyzed to account for the thermal resistance at the diamond@B_4C-Cu interface boundary.
机译：B_4C涂层金刚石（diamond @ B_4C）颗粒用于改善金刚石/铜复合材料的界面结合和热性能。应用扫描电子显微镜，X射线衍射和X射线光电子能谱来表征金刚石颗粒上形成的B_4C涂层。发现B_4C涂层极大地改善了Cu基体与金刚石颗粒之间的界面结合。金刚石@ B_4C / Cu复合材料在金刚石体积分数为60％时显示出665 W / mK的高导热率和7.5×10〜（-6）/ K的低热膨胀系数，这明显优于复合材料带有未涂层的钻石颗粒。理论上还对实验热导率进行了分析，以考虑在Diamond @ B_4C-Cu界面边界处的热阻。

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