首页> 外文期刊>Journal of Materials Engineering and Performance >Electrophoretic Deposition of Cu-SiO2 Coatings by DC and Pulsed DC for Enhanced Surface-Mechanical Properties
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Electrophoretic Deposition of Cu-SiO2 Coatings by DC and Pulsed DC for Enhanced Surface-Mechanical Properties

机译:直流和脉冲直流电泳沉积Cu-SiO2涂层以增强表面机械性能

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摘要

The present study explored the possibilities of improvement in the surface-mechanical properties of electrodeposited Cu-SiO2 composite coating and its underlying mechanism. Composite coatings were developed using SiO2-dispersed acidic copper sulfate electrolyte by direct current and pulse-current electro-codeposition techniques with variation of pulse frequencies at a fixed duty cycle. X-ray diffraction analysis of the coatings revealed information regarding the presence of various phases and crystallographic orientations of the deposited Cu matrix. Scanning electron microscopy and energy dispersive x-ray spectroscopy techniques were used to investigate the surface morphology and chemical composition of the coatings, respectively, and it was observed that SiO2 particles were uniformly distributed in the composite coatings. Surface roughness was found to be reduced with the increasing pulse frequency. The Vickers microhardness and ball-on-plate wear study showed improvement in surface-mechanical properties due to the formation of fine Cu matrix, dispersion strengthening due to homogeneously distributed SiO2 particles, and the preferred orientation of the Cu matrix. Marginal decrease in electrical conductivity with the increasing SiO2 content and pulse frequency was observed from the four-probe electrical conductivity measurement technique.
机译:本研究探索了改善电沉积Cu-SiO2复合涂层表面力学性能的可能性及其潜在机理。使用分散在SiO2中的酸性硫酸铜电解质,通过直流电和脉冲电流电共沉积技术,以固定占空比改变脉冲频率来开发复合涂层。涂层的X射线衍射分析揭示了有关沉积的Cu基体各种相的存在和晶体学取向的信息。分别采用扫描电子显微镜和能谱X射线能谱技术研究了涂层的表面形貌和化学成分,发现SiO2颗粒均匀分布在复合涂层中。发现表面粗糙度随着脉冲频率的增加而减小。维氏显微硬度和板球磨损研究表明,由于形成了细小的铜基体,由于均匀分布的SiO2颗粒而引起的分散增强以及铜基体的优选取向,表面机械性能得到了改善。从四探针电导率测量技术中观察到电导率随SiO2含量和脉冲频率的增加而降低。

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