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Improved microcrystalline silicon TFTs

机译:改进的微晶硅TFT

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摘要

Electron field effect mobility of microcrystalline silicon TFTs, around 40 cm(2)/V S, is obtained thanks to an optimized process. This mobility is about 10 times the usual value of 1-2 cm(2)/V s. This jump is due to the present process where the undoped active layer and the doped layer are deposited in the same run, only by switching on the doping gas valve when the thickness of undoped mu c-Si film is reached. The process allows to remove the interface between these two layers and to improve the crystalline fraction inside the doped mu c-Si film. (c) 2006 Elsevier B.V. All rights reserved.
机译:得益于优化的工艺,微晶硅TFT的电子场效应迁移率约为40 cm(2)/ VS。此迁移率约为通常值1-2 cm(2)/ V s的10倍。这种跳跃是由于本发明的过程,其中仅当达到未掺杂的μc-Si膜的厚度时才打开掺杂气体阀,才能在同一行程中沉积未掺杂的活性层和掺杂层。该工艺允许去除这两​​层之间的界面并改善掺杂的μc-Si膜内部的晶体分数。 (c)2006 Elsevier B.V.保留所有权利。

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