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Fluorinated nanoporous SiO2 films with ultra-low dielectric constant

机译:介电常数超低的氟化纳米多孔SiO2膜

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摘要

Fluorinated nanoporous silica (denoted as SiO2:F) thin films with low dielectric constant were prepared by a sol-gel method and spin coating technique. The leakage current densities of the SiO2:F thin films were 10(-8) and 3 x 10(-6) A/cm(2) respectively for the as-deposited films and for those subjected to annealing at a temperature of 450 degrees C. These currents are more than one order of magnitude lower than those of the common SiO2 films. Photoluminescent results showed strong blue-light emission and a small blue shift in the SiO2:F films that were related to the increment of the porosity. The dielectric properties were also characterized and the k value of the annealed SiO2:F film was found to be about 1.67. The hole size in the films is small and the size distribution is uniform for the annealed SiO2:F samples due to the effects of fluorination. The underlying mechanism for fluorination is discussed in this paper. (c) 2008 Elsevier B.V. All rights reserved.
机译:通过溶胶-凝胶法和旋涂技术制备了介电常数低的氟化纳米多孔二氧化硅(表示为SiO2:F)薄膜。沉积后的膜和在450度温度下退火的膜的SiO2:F薄膜的漏电流密度分别为10(-8)和3 x 10(-6)A / cm(2)这些电流比普通的SiO2膜低一个数量级以上。光致发光结果表明,SiO2:F薄膜具有较强的蓝光发射和较小的蓝移,这与孔隙率的增加有关。还表征了介电性能,并且发现退火的SiO 2:F膜的k值约为1.67。由于氟化作用,退火后的SiO2:F样品中的孔尺寸小且尺寸分布均匀。本文讨论了氟化的潜在机理。 (c)2008 Elsevier B.V.保留所有权利。

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