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首页> 外文期刊>Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites >The effect of HF/NH4F etching on the morphology of surface fractures on fused silica
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The effect of HF/NH4F etching on the morphology of surface fractures on fused silica

机译：HF / NH4F蚀刻对熔融石英表面断裂形貌的影响

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摘要

The effects of HF/NH4F, wet chemical etching on the morphology of individual surface fractures (indentations, scratches) and of an ensemble of surface fractures (ground surfaces) on fused silica glass has been characterized. For the individual surface fractures, a series of static or dynamic (sliding) Vickers and Brinnell indenters were used to create radial, lateral, Hertzian cone and trailing indentation fractures on a set of polished fused silica substrates which were subsequently etched. After short etch times. the visibility of both surface and subsurface cracks is significantly enhanced when observed by optical microscopy. This is attributed to the increased width of the cracks following etching, allowing for greater optical scatter at the fracture interface. The removal of material during etching was found to be isotropic except in areas where the etchant has difficulty penetrating or in areas that exhibit significant plastic deformation/densification. Isolated fractures continue to etch, but will never be completely removed since the bottom and top of the crack both etch at the same rate. The etching behavior of ensembles of closely spaced cracks, such as those produced during grinding, has also been characterized. This was done using a Second set of fused silica samples that were ground using either fixed or loose abrasives. The resulting samples were etched and both the etch rate and the morphology of the surfaces were monitored as a function of time. Etching results in the formation of a series of open cracks or cusps, each corresponding to the individual fractures originally on the surface of the substrate. During extended etching, the individual cusps coalesce with one another, providing a means of reducing the depth of subsurface damage and the peak-to-valley roughness. In addition, the material removal rate of the ground surfaces was found to scale with the surface area of the cracks as a function of etch time. The initial removal rate for the ground surface was typically 3.5 x the bulk etch rate. The evolving morphology of ground surfaces during etching was simulated using an isotropic finite difference model. This model illustrates the importance that the initial distributions of fracture sizes and spatial locations have on the evolution of roughness and the rate at which material is removed during the etching process. The etching of ground surfaces can be used during optical fabrication to convert subsurface damage into surface roughness thereby reducing the time required to produce polished surfaces that are free of subsurface damage.
机译：表征了HF / NH4F，湿法化学蚀刻对熔融石英玻璃上单个表面裂缝（压痕，划痕）的形态和表面裂缝（研磨面）整体的形态的影响。对于单个的表面裂缝，使用一系列的静态或动态（滑动）维氏和Brinnell压头在一组抛光的熔融石英基体上产生径向，横向，赫兹锥和尾随压痕裂缝，随后对其进行蚀刻。经过短时间的蚀刻。当用光学显微镜观察时，表面和亚表面裂纹的可见度都得到了显着提高。这归因于蚀刻之后裂缝的宽度增加，从而允许在断裂界面处更大的光学散射。发现在蚀刻期间材料的去除是各向同性的，除了在蚀刻剂难以渗透的区域或表现出明显的塑性变形/致密化的区域之外。孤立的裂缝继续腐蚀，但永远不会完全消除，因为裂缝的底部和顶部都以相同的速率腐蚀。还已经表征了诸如研磨过程中产生的紧密间隔的裂纹的集合体的蚀刻行为。这是使用第二套熔融二氧化硅样品完成的，这些样品使用固定或松散的磨料研磨。蚀刻所得样品，并监测蚀刻速率和表面形态随时间的变化。蚀刻导致形成一系列开放的裂缝或尖点，每个裂缝或尖点对应于最初在基底表面上的单个裂缝。在延长的蚀刻过程中，各个尖端相互融合，从而提供了一种减少表面下破坏深度和峰谷粗糙度的方法。另外，发现研磨表面的材料去除速率与裂纹的表面积随蚀刻时间成比例。地面的初始去除速率通常为整体蚀刻速率的3.5倍。使用各向同性有限差分模型模拟蚀刻过程中地面的演变形态。该模型说明了裂缝尺寸和空间位置的初始分布对于粗糙度的演变以及蚀刻过程中材料去除速率的重要性。可以在光学制造期间使用对地表面的蚀刻来将表面下的损坏转化为表面粗糙度，从而减少生产没有表面下的损坏的抛光表面所需的时间。

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