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首页> 外文期刊>Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites >Copper as an additive in the As0.4Se0.3Te0.3 glass: Mean atomic volume and T-g
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Copper as an additive in the As0.4Se0.3Te0.3 glass: Mean atomic volume and T-g

机译：铜作为As0.4Se0.3Te0.3玻璃中的添加剂：平均原子量和T-g

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Data on the mean atomic volume (V) and the glass transition temperature (T-g) of the As0.4Se0.3Te0.3 glass, modified with Cu are reported and discussed. The V and T-g of the parent glass are invariant with addition of less than or equal to 1 atomic percent (at.%) of Cu up to which clusters of Cu atoms occupy interlayer positions in the layered network of the parent glass. For additions of Cu > I at.%, a decrease in V and an increase in T-g are observed. The composition dependencies of V and T-g are consistent with a model according to which, with progressive increase in the Cu content, some of the original As2Se3 and As2Te3 structural units of the parent glass are replaced, respectively, by CuAsSe2 and CuAsTe structural units. For Cu greater than or equal to 23.08 at.%, after the formation of CuAsSe2 structural units, there is no free Se available for the formation of As2Se3 structural units; as no free Se is available, a change of slope occurs in the V-composition and T-g-composition data at the Cu content of 23.08 at.%. The increase in T-g with increasing Cu content is due to an increase in the average coordination number brought about by an increase in cross linking due to the formation of tetrahedral CuAsSe2 and CuAsTe complexes in the glasses. (C) 1997 Elsevier Science B.V.
机译：报告并讨论了用Cu改性的As0.4Se0.3Te0.3玻璃的平均原子体积（V）和玻璃化转变温度（T-g）的数据。母体玻璃的V和T-g不变，且添加的Cu小于或等于1原子百分数（原子％），在母体玻璃的层状网络中，Cu原子簇占据层间位置。对于Cu> I at。％的添加，观察到V的降低和T-g的提高。 V和T-g的成分依赖性与一个模型一致，根据该模型，随着Cu含量的逐渐增加，母体玻璃的某些原始As2Se3和As2Te3结构单元分别被CuAsSe2和CuAsTe结构单元代替。对于Cu大于或等于23.08 at。％的CuAsSe2结构单元形成之后，没有游离的Se可用于As2Se3结构单元的形成。由于没有可用的游离硒，因此当Cu含量为23.08 at。％时，V组成和T-g组成数据会发生斜率变化。 T-g随着Cu含量的增加而增加，是由于在玻璃中形成四面体CuAsSe2和CuAsTe络合物导致交联增加而导致平均配位数增加。 （C）1997年Elsevier Science B.V.

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