Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs

Sparks D; Massoud-Ansari S; Najafi N

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Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs

机译：带有通孔的耐热玻璃密封硅对耐热玻璃的长期评估

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The reliability of bonding silicon to Pyrex wafers using a reflowed glass frit seal is examined in this paper. The Pyrex wafers have metal feedthroughs, which are used to actuate and capacitively sense a single-crystal, silicon resonator. Long-term, high-temperature storage conditions for chips with and without getters are examined. The reflowed glass seal is demonstrated to be hermetic for years at high temperature using both diaphragm deflection and the Q and frequency of resonators as a vacuum indicator. The use of a thin film getter is found to eliminate Q hysteresis due to gas desorption and adsorption, observed in other resonators studies.

机译：本文研究了使用回流玻璃粉密封将硅粘结到派热克斯晶片上的可靠性。 Pyrex晶圆具有金属馈通，用于激励和电容感应单晶硅谐振器。检查有无吸气剂的芯片的长期高温存储条件。事实证明，使用隔膜挠度以及谐振器的Q和频率作为真空指示器，回流玻璃密封件在高温下可密封多年。发现在其他谐振器研究中发现，使用薄膜吸气剂可消除由于气体的脱附和吸附而引起的Q磁滞现象。

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《Journal of Micromechanics and Microengineering》 |2005年第8期|共5页
作者
Sparks D; Massoud-Ansari S; Najafi N;
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原文格式 PDF
正文语种 eng
中图分类仪器、仪表;
关键词
CHIP; MICROMACHINES; SENSORS;

机译：芯片;微机械;传感器;

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1. Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs [J] . Sparks D, Massoud-Ansari S, Najafi N Journal of Micromechanics and Microengineering . 2005,第8期

机译：带有通孔的耐热玻璃密封硅对耐热玻璃的长期评估
2. A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators [J] . Ziaie B., Von Arx J.A. Journal of Microelectromechanical Systems . 1996,第3期

机译：密封的玻璃-硅微封装，具有高密度的芯片通孔，用于传感器和执行器
3. Advanced MEMS Process for Wafer Level Hermetic Encapsulation of MEMS Devices Using SOI Cap Wafers With Vertical Feedthroughs [J] . Torunbalci Mustafa Mert, Alper Said Emre, Akin Tayfun Microelectromechanical Systems, Journal of . 2015,第3期

机译：使用具有垂直馈通的SOI盖晶片的MEMS晶片级气密封装的先进MEMS工艺
4. Micromachining of Pyrex7740 glass and their applications to wafer-level hermetic packaging of MEMS devices [C] . Junwen Liu, Qing-An Huang, Jintang Shang, Micro Electro Mechanical Systems (MEMS), 2010 . 2010

机译：Pyrex7740玻璃的微加工及其在MEMS器件的晶圆级气密包装中的应用
5. Hermetic glass-silicon micropackages and feedthroughs for neural prostheses. [D] . Dokmeci, Mehmet Remzi. 2000

机译：用于神经假体的密封玻璃-硅微封装和引线。
6. Monolithically Integrated Diffused Silicon Two-Zone Heaters for Silicon-Pyrex Glass Microreactors for Production of Nanoparticles: Heat Exchange Aspects [O] . Milena Rašljić Rafajilović, Katarina Radulović, Milče M. Smiljanić, 2020

机译：用于硅-Pyrex玻璃微反应器的单片集成的扩散硅双区加热器用于生产纳米粒子：热交换方面
7. HERMETIC PACKAGING OF RESONATORS WITH VERTICAL FEEDTHROUGHS USING A GLASS-IN-SILICON REFLOW PROCESS [O] . R. M. Haque, D. E. Serrano, X. Gao, 2015

机译：使用玻璃 - 硅回流工艺对垂直进料的共振器进行密封包装
8. Aerospace Sensor Component and Subsystem Investigation and Innovation-2 Component Exploration and Development (ASCSII-2 CED) Delivery Order 0003: Hermetically Sealed Cavities in 3-D GaAs-Silicon and Silicon-Silicon Packages for Microelectromechanical System (MEMS) Devices Using Selective and Large-Scale Bonding [R] . Malshe, A. P. 2003

机译：航空航天传感器组件和子系统调查与创新-2组件探索与开发（asCsII-2 CED）交付订单0003：采用选择性和大型的微机电系统（mEms）器件的三维Gaas硅和硅硅封装的气密密封腔 - 规模粘合

Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs

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