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首页> 外文期刊>Journal of Micromechanics and Microengineering >Process for the fabrication of hollow core solenoidal microcoils in borosilicate glass
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Process for the fabrication of hollow core solenoidal microcoils in borosilicate glass

机译：在硼硅酸盐玻璃中制造空心螺线管微线圈的方法

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摘要

We report the fabrication of solenoidal microcoils with hollow core embedded within two 100 μm thick borosilicate glass wafers. The main process steps are the reactive ion etching of borosilicate glass, anodic wafer bonding, copper metal organic chemical vapor deposition (Cu MOCVD) and electroless galvanization. Our motivation stems from the need for a reliable, precise fabrication method of microcoils for high-resolution magnetic resonance imaging (MRI). For reduced loss at high-frequency operation, glass, with a lower dielectric constant as compared to silicon, was chosen as a substrate material. Simultaneously, this offers MRI sample observation owing to its optical transparency. Further essential parameters for the coil design were the need for small coil dimensions, a high filling factor (region of interest within the coil occupied by the sample/overall coil volume), and low-loss electrical connectability to external devices. In an attempt to achieve those requirements, the reported process demonstrates the combination of front- and backside borosilicate glass RIE of small dimensional features (down to 10 μm wall thickness) with subsequent conformal metallization of the 3D solenoidal coil by means of Cu MOCV and electroless galvanization.
机译：我们报道了螺线管微线圈的制造，该微线圈的空心嵌入在两个100μm厚的硼硅酸盐玻璃晶圆中。主要工艺步骤是硼硅酸盐玻璃的反应离子刻蚀，阳极晶圆键合，铜金属有机化学气相沉积（Cu MOCVD）和化学镀锌。我们的动力来自对高分辨率磁共振成像（MRI）的可靠，精确的微线圈制造方法的需求。为了减少高频操作下的损耗，选择了介电常数比硅低的玻璃作为基材。同时，由于其光学透明性，因此可以提供MRI样本观察。线圈设计的其他基本参数是：需要较小的线圈尺寸，较高的填充系数（样品内/整个线圈体积占线圈内的目标区域）以及与外部设备的低损耗电连接性。为了达到这些要求，所报告的过程证明了具有小尺寸特征（壁厚低至10μm）的正面和背面硼硅玻璃RIE以及随后通过Cu MOCV和化学镀的3D螺线管保形金属化的结合镀锌。

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