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首页> 外文期刊>Journal of Micromechanics and Microengineering >Femtosecond laser machining of multi-depth microchannel networks onto silicon
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Femtosecond laser machining of multi-depth microchannel networks onto silicon

机译:飞秒激光加工硅上的多深度微通道网络

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摘要

Direct writing of multi-depth microchannel branching networks into a silicon wafer with femtosecond pulses at 200 kHz is reported. The silicon wafer with the microchannels is used as the mold for rapid prototyping of microchannels on polydimethylsiloxane. The branching network is designed to serve as a gas exchanger for use in artificial lungs and bifurcates according to Murray's law. In the development of such micro-fluidic structures, processing speed, machining range with quality surface, and precision are significant considerations. The scan speed is found to be a key parameter to reduce the processing time, to expand the machining range, and to improve the surface quality. By fabricating a multi-depth branching network as an example, the utilization of femtosecond pulses in the development of microfluidic devices is demonstrated.
机译:据报道,使用飞秒脉冲以200 kHz的频率将多深度微通道分支网络直接写入硅晶片。具有微通道的硅晶片用作在聚二甲基硅氧烷上快速构建微通道原型的模具。根据Murray的定律,分支网络旨在用作人造肺和分叉的气体交换器。在开发这种微流体结构时,加工速度,具有优质表面的加工范围和精度是重要的考虑因素。发现扫描速度是减少加工时间,扩大加工范围并改善表面质量的关键参数。通过以多深度分支网络为例,证明了飞秒脉冲在微流控设备开发中的利用。

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