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首页> 外文期刊>Journal of Micromechanics and Microengineering >Simple and low cost method for metal-based micro-capillary channels for heat exchanger use
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Simple and low cost method for metal-based micro-capillary channels for heat exchanger use

机译：用于热交换器的金属基微毛细管通道的简单，低成本方法

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In this work, we present an alternative, low cost method for the fabrication of a heat exchanger utilizing metal-based microchannels using the UV-LiGA technique. Lithography is used to pattern dry film negative photoresist (Ordyl P-50100) on the substrate. The resist is laminated over the substrate and exposed with a UV source. The use of dry film resist allows for simple and inexpensive microchannel patterns without requiring advanced cleanroom equipment. Following the lithography process, electrodeposition of metals is used to fill the recesses patterned in the resist. In this work, nickel has been electroplated into the bounding resist structure. After electroplating, the remaining resist is dissolved leaving free standing metal structures. The fabricated exchanger is then evaluated based on thermal absorption of simulated waste heat sources and capillary action of the metal channels themselves. Channels are fabricated to heights of 60, 70 and 90 μm respectively on copper substrate using these methods. Working fluid mass transfer rate from the heated microchannel heat exchanger (MHE) is utilized as a basic metric of operation. The mass transfer rate recorded from the nickel-based MHE is 2.19, 2.81 and 3.20 mg s~(-1) respectively for the different channel heights. This implies an effective thermal power consumption rate of 1.66, 2.13 and 2.42 kW m~(-2) respectively. By contrast, an MHE fabricated with 115 and 142 μm tall channels on silicon substrate is shown to evaporate up to 2.84 and 3.04 mg s~(-1) respectively, giving an effective thermal power consumption of 2.15 and 2.31 kW m~(-2) respectively. An investigation of working fluid contact angle with the electroplated nickel surface is also presented. The surface is found to be a porous structure stemming from the electroplating process.
机译：在这项工作中，我们提出了一种利用UV-LiGA技术利用金属基微通道制造热交换器的替代低成本方法。光刻用于在基板上对干膜负性光刻胶（Ordyl P-50100）进行构图。将抗蚀剂层压在衬底上，并用紫外线源曝光。干膜抗蚀剂的使用允许简单且廉价的微通道图案，而无需先进的洁净室设备。在光刻工艺之后，金属的电沉积用于填充抗蚀剂中构图的凹槽。在这项工作中，镍已被电镀到边界抗蚀剂结构中。电镀后，剩余的抗蚀剂被溶解，剩下独立的金属结构。然后根据模拟废热源的热吸收和金属通道本身的毛细作用来评估所制造的交换器。使用这些方法，在铜基板上分别将通道制造为60、70和90μm的高度。来自加热的微通道热交换器（MHE）的工作流体传质速率被用作基本操作指标。对于不同的通道高度，从镍基MHE记录的传质速率分别为2.19、2.81和3.20 mg s〜（-1）。这意味着有效热耗率分别为1.66、2.13和2.42 kW m〜（-2）。相比之下，在硅基板上制造的具有115和142μm高通道的MHE分别蒸发高达2.84和3.04 mg s〜（-1），有效功耗为2.15和2.31 kW m〜（-2 ） 分别。还介绍了工作流体与电镀镍表面的接触角的研究。发现该表面是源自电镀过程的多孔结构。

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