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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Development of x-ray topographic microscopy for the study of electromigration in interconnects
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Development of x-ray topographic microscopy for the study of electromigration in interconnects

机译：用于研究互连中电迁移的X射线形貌显微镜的开发

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We have performed x-ray topography experiments in a new configuration using a Fresnel zone plate to form a magnified image of the sample intensity distribution on the detector plane. The main difference from the x-ray topography techniques where no optics is used between the sample and the detector, is the absence of free space propagation effects in the image and the possibility to form a magnified image. Other advantages include large working distance around the sample and low background radiation on the detector. As a first application, we recorded x-ray topographs of an Al interconnect structure as a function of time in an in situ electromigration experiment. The contrast in the images is explained in terms of lattice deformations caused by the stress in the metal films. The results show the evolution of stress due to the electromigration process. The technique should make it possible to obtain best possible spatial resolution allowed by the sample in x-ray topography. [References: 11]
机译：我们已经使用菲涅耳波带片以新配置进行了X射线形貌实验，以在检测器平面上形成样品强度分布的放大图像。与在样品和检测器之间不使用光学器件的X射线形貌技术的主要区别在于，图像中不存在自由空间传播效应，并且可能形成放大图像。其他优点包括样品周围的工作距离长以及检测器上的背景辐射低。作为第一个应用，我们在原位电迁移实验中记录了Al互连结构随时间变化的X射线形貌图。图像中的对比度是根据金属膜中的应力引起的晶格变形来解释的。结果表明由于电迁移过程应力的演变。该技术应使其能够在X射线地形图中获得样品所允许的最佳空间分辨率。 [参考：11]

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