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首页> 外文期刊>Journal of the Chinese Society of Mechanical Engineers, Series C: Transactions of the Chinese Society of Mechanical Engineers >Theoretical Model of Calculating Cutting Force and Down Force for Nanocutting of V-Shaped Groove on Single-Crystal Silicon
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Theoretical Model of Calculating Cutting Force and Down Force for Nanocutting of V-Shaped Groove on Single-Crystal Silicon

机译：计算单晶硅上V形槽纳米切削的切削力和下压力的理论模型

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摘要

Taking atomic force microscopic (AFM) diamond probe as a tool, this paper conducts experiments and analysis of nanocutting of V-shaped groove on the surface of single-crystal silicon (Si) substrate, and innovatively proposes using the concept of specific down force energy (SDFE) of different axles to develop a theoretical model for calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal Si substrate. This paper firstly conducts an experiment of nanoscale cutting of V-shaped groove by AFM probe under the fixed down force. Then it can obtain the SDFE value for nanocutting of single-crystal Si. According to the SDFE theoretical equations of different axles as well as the known cutting depth for nanocutting of single-crystal Si and the shape and size of the cutting tool of probe, this paper calculates the down force and cutting force for nanocutting of V-shaped groove on single-crystal Si workpiece. This paper compares the calculated values of down force and cutting force by using SDFE theoretical equations with the down force and cutting force obtained from simulation using the simulation model of three-dimensional quasi-steady molecular statics nanocutting, and then verifies that the SDFE theoretical equation of different axles proposed by this paper can calculate the cutting force and down force for nanocutting of V-shaped groove on single-crystal Si.
机译：以原子力显微镜（AFM）金刚石探针为工具，对单晶硅（Si）衬底表面的V形槽进行纳米切割的实验和分析，并提出了利用比力能量的概念进行创新的建议（SDFE），以开发一个理论模型来计算单晶硅衬底上V形凹槽的纳米切割的切割力和向下力。本文首先在固定的向下压力下进行了AFM探针对V形凹槽的纳米切割实验。然后可以获得用于单晶硅纳米切割的SDFE值。根据不同轴的SDFE理论方程式，以及已知的单晶硅纳米切削的切削深度和探针切削工具的形状和尺寸，计算出V形纳米切削的下压力和切削力单晶硅工件上的凹槽。将SDFE理论方程计算的下压力和切削力与三维准稳态分子静态纳米切削模拟模型模拟得到的下压力和切削力进行比较，验证了SDFE理论方程的正确性。本文提出的不同轴的切削力可以计算出在单晶硅上对V形槽进行纳米切削的切削力和向下力。

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