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首页> 外文期刊>Journal of the Chinese Society of Mechanical Engineers, Series C: Transactions of the Chinese Society of Mechanical Engineers >An integrated approach to semiconductor equipment monitoring
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An integrated approach to semiconductor equipment monitoring

机译：半导体设备监控的集成方法

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摘要

In semiconductor fabrication processes, real-time equipment monitoring and fault detection become critical as most problems reveal themselves first on the equipment performance and much later on the wafer quality. The sooner we can detect the problem, the lower the production loss. The goal of this paper is to present an integrated semiconductor equipment monitoring approach. A semiconductor PECVD tool will be used as the study vehicle. The approach will include: (1) simultaneous monitoring scheme: a dartboard display of real-time data that provides an easy reading of the equipment's overall status, (2) system health index: an index that evaluates the equipment's overall health, and (3) statistical monitoring function: statistical charting function that integrates run-to-run SPC, real-time SPC, and other advanced SPC functions. The system has been implemented in tsmc FAB IV for testing. The preliminary results show that the proposed system is an effective tool for real-time monitoring and fault detection.
机译：在半导体制造过程中，实时的设备监视和故障检测变得至关重要，因为大多数问题首先在设备性能上展现出来，然后在晶圆质量上展现出来。我们越早发现问题，生产损失就越低。本文的目的是提出一种集成的半导体设备监控方法。半导体PECVD工具将用作研究工具。该方法将包括：（1）同时监视方案：实时数据的飞镖式显示，可轻松读取设备的整体状态;（2）系统健康指数：评估设备总体健康的指数;以及（3 ）统计监视功能：统计图表功能，集成了运行间SPC，实时SPC和其他高级SPC功能。该系统已在tsmc FAB IV中实施以进行测试。初步结果表明，该系统是实时监测和故障检测的有效工具。

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