首页> 外文期刊>Journal of Semiconductors >Effect of phosphorus ion implantation on back gate effect of partially depleted SOI NMOS under total dose radiation
【24h】

Effect of phosphorus ion implantation on back gate effect of partially depleted SOI NMOS under total dose radiation

机译:总剂量辐射下磷离子注入对部分耗尽SOI NMOS背栅效应的影响

获取原文
获取原文并翻译 | 示例
           

摘要

The mechanism of improving the TID radiation hardened ability of partially depleted silicon-on-insulator (SOI) devices by using the back-gate phosphorus ion implantation technology is studied. The electron traps introduced in SiO_2 near back SiO_2/Si interface by phosphorus ions implantation can offset positive trapped charges near the back-gate interface. The implanted high concentration phosphorus ions can greatly reduce the back-gate effect of a partially depleted SOI NMOS device, and anti-total-dose radiation ability can reach the level of 1 Mrad(Si) for experimental devices.
机译:研究了利用背栅磷离子注入技术提高部分耗尽型绝缘体上硅(SOI)器件的TID辐射硬化能力的机理。通过磷离子注入在背SiO_2 / Si界面附近的SiO_2中引入的电子陷阱可以抵消背栅界面附近的正陷阱电荷。注入的高浓度磷离子可以大大降低部分耗尽的SOI NMOS器件的背栅效应,并且抗总剂量辐射能力可以达到1 Mrad(Si)的实验器件水平。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号