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首页> 外文期刊>日本セラミックス協会学術論文誌 >Fabrication of Al-Si_3N_4 Composites Using a High-Strength Porous Si_3N_4 Ceramic and Their Thermal Conductivity
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Fabrication of Al-Si_3N_4 Composites Using a High-Strength Porous Si_3N_4 Ceramic and Their Thermal Conductivity

机译:高强度多孔Si_3N_4陶瓷制备Al-Si_3N_4复合材料及其热导率

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摘要

Al- Si_3N_4 composites were fabricated by infiltration of Al melt with Si contents from 0 to 22 vol percent into a porous Si_3N_4 ceramic and their thermal conductivity was evaluated. A porous Si_3N_4 ceramic having a porosity of 39.5 percent and consisting of elongated #beta#- Si_3N_4 grains connected at random in three dimensions was used as a substrate. The Al- Si_3N_4 composites were fabricated by infiltration of Al-Si alloys melt into the porous Si_3N_4 ceramic at 800 deg C under a pressure of 90 MPa using hot isostatic pressing (HIP). Although increasing Si content significantly decreased the thermal conductivity of the Al-Si alloys, the decrease in thermal conductivity of the resulting composites was small due to increased thermal barrier conductances of the interfaces between Al and Si_3N_4.
机译:通过将Si含量为0至22 vol%的Al熔体渗入多孔Si_3N_4陶瓷中来制备Al-Si_3N_4复合材料,并评估其导热系数。将具有39.5%的孔隙率并且由在三维上随机连接的细长的#beta#-Si_3N_4晶粒组成的多孔Si_3N_4陶瓷用作衬底。通过使用热等静压(HIP)在800摄氏度,压力90 MPa下将熔融的Al-Si合金渗透到多孔Si_3N_4陶瓷中来制造Al-Si_3N_4复合材料。尽管增加Si含量显着降低了Al-Si合金的热导率,但是由于增加了Al和Si_3N_4之间的界面的热障电导率,因此所得复合材料的热导率降低很小。

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