Electromigration Lifetime Test in Damascene Copper Interconnects using Sudden Death Test Structure and OBIRCH

Shinji Yokogawa

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Electromigration Lifetime Test in Damascene Copper Interconnects using Sudden Death Test Structure and OBIRCH

机译：使用突然死亡测试结构和OBIRCH在镶嵌铜互连中进行电迁移寿命测试

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The bimodal electromigration lifetime of damascene Cu interconnects was investigated by using a new sudden death test structure.Parameter estimation by the test structure is highly superior to that ofnon-sudden death approach even with a small sample size.In addition,the test structure shortens the reliability test period of electromigration.The test structure was amenable to failure analysis tools such as OBIRCH.Early failure was due to the void growht in the bottom of Via.Intrinsic failure was due to the void growth under Via.

机译：通过使用新的猝死测试结构研究了镶嵌铜互连的双峰电迁移寿命。即使样品量很小，测试结构的参数估计也比非突然死亡方法的参数估计高得多。此外，测试结构缩短了电迁移的可靠性测试期。测试结构适合于OBIRCH等故障分析工具。早期故障是由于Via底部的空洞增长引起的;固有故障是由于Via下的空隙增长。

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《信頼性》 |2003年第8期|共10页
作者
Shinji Yokogawa;
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原文格式 PDF
正文语种 jpn
中图分类工业规程与标准;
关键词
electromigration; sudden death test structure; obirch; damascene cu interconnect; bimodal distribution;

机译：电迁移;突然死亡测试结构;结扎;镶嵌铜互连;双峰分布;

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专利

1. Electromigration Lifetime Test in Damascene Copper Interconnects using Sudden Death Test Structure and OBIRCH [J] . Shinji Yokogawa 信頼性 . 2003,第8期

机译：使用突然死亡测试结构和OBIRCH在镶嵌铜互连中进行电迁移寿命测试
2. Electromigration Lifetime Test in Damascene Copper Interconnects using Sudden Death Test Structure and OBIRCH [J] . Shinji Yokogawa 信頼性 . 2003,第8期

机译：使用突然死亡测试结构和OBIRCH在镶嵌铜互连中进行电迁移寿命测试
3. Electromigration Lifetime Test in Damascene Copper Interconnects using Sudden Death Test Structure and OBIRCH [J] . Shinji Yokogawa 信頼性 . 2003,第8期

机译：使用突发死亡测试结构和obirch的镶嵌铜互连的电迁移寿命试验
4. Electromigration characterization of damascene copper interconnects using normally and highly accelerated tests [C] . T. Berger, L. Arnaud, R. Gonella, European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis . 2000

机译：使用正常和高加速测试的镶嵌铜互连的电迁移
5. Investigation of the influence of microstructure on electromigration in damascene copper interconnects. [D] . Chang, Nicole Meier. 2002

机译：研究金属结构对镶嵌铜互连中电迁移的影响。
6. A compact model for early electromigration failures of copper dual-damascene interconnects [O] . R.L. de Orio, H. Ceric, S. Selberherr -1

机译：铜双镶嵌互连的早期电迁移失败的紧凑模型
7. Conditional Variables Double Sampling Plan for Weibull Distributed Lifetimes under Sudden Death Testing [O] . S. Balamurali 2012

机译：突然死亡测试下威布尔分布寿命的条件变量双采样计划

Electromigration Lifetime Test in Damascene Copper Interconnects using Sudden Death Test Structure and OBIRCH

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