Micropore x-ray optics using anisotropic wet etching of (110) silicon wafers

Yuichiro Ezoe; Masaki Koshiishi; Makoto Mita; Kazuhisa Mitsuda; Akio Hoshino; Yoshitaka Ishisaki; Zhen Yang; Takayuki Takano; Ryutaro Maeda

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Micropore x-ray optics using anisotropic wet etching of (110) silicon wafers

机译：使用（110）硅片的各向异性湿法刻蚀的微孔X射线光学器件

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To develop x-ray mirrors for micropore optics, smooth silicon (111) sidewalls obtained after anisotropic wet etching of a silicon (110) wafer were studied. A sample device with 19 (mu)m wide (111) sidewalls was fabricated using a 220 (mu)m thick silicon (110) wafer and potassium hydroxide solution. For what we believe to be the first time, x-ray reflection on the (111) sidewalls was detected in the angular response measurement. Compared to ray-tracing simulations, the surface roughness of the sidewalls was estimated to be 3-5 nm, which is consistent with the atomic force microscope and the surface profiler measurements.

机译：为了开发用于微孔光学器件的X射线反射镜，研究了在对硅（110）晶圆进行各向异性湿法刻蚀之后获得的光滑硅（111）侧壁。使用220μm厚的硅（110）晶圆和氢氧化钾溶液制造了具有19μm宽（111）侧壁的样品设备。我们相信这是第一次，在角响应测量中检测到（111）侧壁上的X射线反射。与光线追踪模拟相比，侧壁的表面粗糙度估计为3-5 nm，这与原子力显微镜和表面轮廓仪的测量结果一致。

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《Applied optics》 |2006年第35期|共7页
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Yuichiro Ezoe; Masaki Koshiishi; Makoto Mita; Kazuhisa Mitsuda; Akio Hoshino; Yoshitaka Ishisaki; Zhen Yang; Takayuki Takano; Ryutaro Maeda;
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1. Micropore x-ray optics using anisotropic wet etching of (110) silicon wafers [J] . Yuichiro Ezoe, Masaki Koshiishi, Makoto Mita, Applied Optics . 2006,第35期

机译：使用（110）硅片的各向异性湿法刻蚀的微孔X射线光学器件
2. Micropore x-ray optics using anisotropic wet etching of (110) silicon wafers [J] . Yuichiro Ezoe, Masaki Koshiishi, Makoto Mita, Applied optics . 2006,第35期

机译：使用（110）硅片的各向异性湿法刻蚀的微孔X射线光学器件
3. Evaluation of the soft x-ray reflectivity of micropore optics using anisotropic wet etching of silicon wafers [J] . Ikuyuki Mitsuishi, Yuichiro Ezoe, Masaki Koshiishi, Applied optics . 2010,第6期

机译：使用硅晶片各向异性湿法刻蚀评估微孔光学器件的软X射线反射率
4. Low voltage optical switches fabricated by anisotropic wet etching of (110) and (111) silicon wafers [C] . Dong Wei, College of Electronic sciences Engineering, Liu Caixia, 第5届国际光通信与网络年会暨第2届纤维光学发展现状与未来趋势国际学术研讨会论文集 . 2006

机译：通过对（110）和（111）硅片进行各向异性湿法蚀刻制成的低压光开关
5. Mechanism of wet anisotropic etching of silicon for nano-scale applications. [D] . Stateikina, Irina. 2007

机译：用于纳米级应用的硅湿各向异性刻蚀机理。
6. Effect of Isopropyl Alcohol Concentration and Etching Time on Wet Chemical Anisotropic Etching of Low-Resistivity Crystalline Silicon Wafer [O] . Eyad Abdur-Rahman, Ibrahim Alghoraibi, Hassan Alkurdi 2017

机译：异丙醇浓度和刻蚀时间对低电阻晶体硅晶片湿化学各向异性刻蚀的影响
7. Nanomachining of (110)-oriented silicon by scanning probe lithography and anisotropic wet etching [O] . F. S.-S. Chien 2011

机译：通过扫描探针光刻和各向异性湿法刻蚀对（110）取向硅进行纳米加工
8. Technique for protecting chip corners in wet chemical etching of silicon wafers [R] . Hui, W. C. 1991

机译：在硅晶片的湿化学蚀刻中保护芯片角的技术

Micropore x-ray optics using anisotropic wet etching of (110) silicon wafers

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