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CAFM investigations of filamentary conduction in Cu_2O ReRAM devices fabricated using stencil lithography technique

机译:使用模板光刻技术制造的Cu_2O ReRAM器件中的丝状传导的CAFM研究

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摘要

With the objective of understanding the role of size and current level of filamentary regions on the resistive switching parameters, detailed conductive atomic force microscope investigations of resistive memory cells having different dimensions have been carried out in this study. Cu-Cu_2O-Ti memory cells having dimensions of 150, 50 and 25 mm have been fabricated on the same substrate using a stencil lithography technique. The dependence of resistive switching parameters on the device dimensions can be directly related to the average size, current level of the filaments and difference in these parameters between the low resistance state (LRS) and high resistance state (HRS). It is observed that the large increase in the ratio of current in the two states in cells having lower dimensions is mainly due to the smaller number of conducting regions in the HRS, indicating efficient switching from the LRS to the HRS at lower dimensions.
机译:为了理解丝状区域的大小和电流水平在电阻切换参数上的作用,在本研究中对具有不同尺寸的电阻存储单元进行了详细的导电原子力显微镜研究。使用模板光刻技术已在同一基板上制造了尺寸为150、50和25 mm的Cu-Cu_2O-Ti存储单元。电阻切换参数对器件尺寸的依赖性可以直接与平均尺寸,灯丝电流水平以及低电阻状态(LRS)和高电阻状态(HRS)之间的这些参数之间的差异相关。可以看出,具有较小尺寸的单元中的两种状态的电流之比的较大增加主要是由于HRS中导电区域的数量较少,这表明在较小尺寸下从LRS到HRS的有效切换。

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