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Transport losses in polygonal assemblies of coated conductors with textured-metal substrate

机译:带纹理金属基材的涂覆导体的多边形组件中的传输损耗

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摘要

Transport loss characteristics of polygonal assemblies of coated conductors with textured-metal substrate were studied. Coated conductors using two types of textured-metal tape as their substrate were prepared for the experiments: a Ni alloy substrate and a clad-type substrate with reduced magnetism. First, the transport losses of hexagonal assemblies of coated conductors with non-magnetic substrate were measured where the textured-metal tapes were under-lied or over-lied on the coated conductors to simulate the coated conductors fabricated with these textured-metal substrates. The over-lied Ni alloy tapes affect transport loss characteristics substantially: the over-lied or under-lied clad tapes do not substantially affect them. Next, two types of hexagonal assemblies were made using coated conductors fabricated with the textured-metal substrates: the substrates were placed inside in one of them, and they were placed outside in the other. In case of the coated conductors fabricated with the Ni alloy substrate, the measured transport loss of the latter was much larger than that of the former, because the substrates placed outside were exposed to the magnetic field generated around the assembled coated conductors. The measured transport losses reasonably agree with the numerically-calculated ones. In case of the coated conductors fabricated with the clad substrate, the difference between the transport losses of the two types of the assemblies is much smaller; the influence of the magnetism of the clad substrate on AC losses is reasonably small.
机译:研究了带纹理金属基体的涂覆导体的多边形组件的输运损耗特性。为实验准备了使用两种类型的带纹理的金属带作为基底的涂层导体:Ni合金基底和磁性降低的包覆型基底。首先,测量带非磁性基材的涂覆导体的六角形组件的传输损耗,在该位置上,将带纹理的金属带欠铺或过铺在涂覆的导体上,以模拟用这些带纹理的金属基材制造的涂覆导体。上层镍合金带会严重影响传输损耗特性:上层或下层复合带不会显着影响它们。接下来,使用由带纹理金属基板制成的涂覆导体制作两种六角形组件:将基板放置在其中一个的内部,将基板放置在另一个的外部。在用镍合金基底制造涂层导体的情况下,后者的测量的传输损耗比前者大得多,这是因为放置在外部的基底暴露于组装的涂层导体周围产生的磁场。测得的运输损失与数值计算的损失合理地吻合。如果用覆层基板制造涂覆导体,则两种组件的传输损耗之差要小得多。覆层基板的磁性对AC损耗的影响相当小。

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