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首页> 外文期刊>Surface & Coatings Technology >Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing
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Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing

机译：双层涂层对真空热压法制备金刚石/铜复合材料组织和导热性能的影响

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摘要

Diamond/Cu composites with high density and good thermal properties are fabricated by vacuum hot pressing via designing dual layers on the diamond particles. Different types of inner tungsten layers are coated on diamond after annealing with the loose tungsten powder, and the outer copper layer is then deposited using electroless plating. The effects of dual layers on the microstructure and thermal conductivities of diamond/Cu composite are investigated. The results indicate that the tungsten coating exhibits integrated and uniform structure when the diamond is treated with tungsten powder at 900 degrees C for 2 h. This tungsten coating improves the interfacial bonding and minimizes the thermal boundary resistance between the diamond and the copper matrix. Moreover, the outside copper coating promotes the sintering process, and hence favors the low-temperature densification of diamond/Cu composites. The thermal conductivity of diamond/Cu composites reaches 721 W m(-1) K-1, which is close to the theoretical value. (C) 2015 Elsevier B.V. All rights reserved.
机译：通过在金刚石颗粒上设计双层真空真空压制，可以制造出具有高密度和良好热性能的金刚石/铜复合材料。用疏松的钨粉退火后，将不同类型的内部钨层涂覆在金刚石上，然后使用化学镀沉积外部铜层。研究了双层对金刚石/铜复合材料微观结构和热导率的影响。结果表明，将金刚石在900摄氏度下用钨粉处理2小时后，钨涂层呈现出整体均匀的结构。这种钨涂层改善了界面结合，并使金刚石和铜基体之间的热边界电阻最小。此外，外部铜涂层促进了烧结过程，因此有利于金刚石/铜复合材料的低温致密化。金刚石/铜复合材料的导热系数达到721 W m（-1）K-1，接近理论值。 （C）2015 Elsevier B.V.保留所有权利。

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