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Synthesis and characterizations of a latent polyhedral oligomeric silsequioxane-containing catalyst and its application in polybenzoxazine resin

机译:潜在的含多面体低聚倍半硅氧烷的催化剂的合成,表征及其在聚苯并恶嗪树脂中的应用

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摘要

In this article, a novel latent curing agent, octa(paratoluenesulfonic acid ammomium salt) (OPAAS) polyhedral oligomeric silsequioxane was synthesized and used in modifying the polybenzoxazine/2,2'-(1,3-phenylene)-bis(4,5-dihydro- oxazoles) (PBO) (PBZ/PBO) resin. The liberated octa(aminophenyl) silsesquioxane and paratoluenesulfonic acid can catalyze the ring-opening reaction of benzoxazine (BZ) resin. The initial curing temperature (T _i), peak curing temperature (T _p) and the Enthalpy of the curing temperature had significantly decreased with respect to pristine BZ/PBO resin. When the OPAAS amount was 3 wt %, the peak curing temperature decreased from 233.7 to 218.2°C. Also, PBZ/PBO/OPAAS composites exhibited better storage modulus than pure PBZ/PBO resin. Meanwhile, PBZ/PBO/OPAAS composites are more thermally stable than PBZ/PBO resin.
机译:本文合成了一种新型的潜在固化剂八(对甲苯磺酸铵盐)(OPAAS)多面体低聚倍半硅氧烷,并将其用于改性聚苯并恶嗪/ 2,2'-(1,3-亚苯基)-双(4,5) -二氢-恶唑(PBO)(PBZ / PBO)树脂。释放的八(氨基苯基)倍半硅氧烷和对甲苯磺酸可以催化苯并恶嗪(BZ)树脂的开环反应。相对于原始的BZ / PBO树脂,初始固化温度(T _i),峰值固化温度(T _p)和固化温度的焓显着降低。当OPAAS量为3wt%时,峰值固化温度从233.7℃降低至218.2℃。同样,PBZ / PBO / OPAAS复合材料比纯PBZ / PBO树脂具有更好的储能模量。同时,PBZ / PBO / OPAAS复合材料比PBZ / PBO树脂更热稳定。

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