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首页> 外文期刊>Journal of Applied Polymer Science >Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices
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Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices

机译：酸酐固化剂，咪唑和银的粒径对LED器件银粘合剂中电阻率和导热率的影响

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This study investigated the preparation of silver adhesives applied to a light-emitting diode (LED) device as die-attach materials consisting of silver particles, on epoxy resin, curing agents, and accelerants for complete curing at 150 degrees C for 30 min. For the epoxy resin, this study used 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexanecarboxylate mixed with different types of anhydride curing agents such as 4-methylcyclohexane-1,2-dicarboxylic anhydride and hexahydrophthalic anhydride as well as imidazole accelerants such as 2-ethyl-4-methyl-1H-imidazole-1-propanenitrile, 2-phenylimidazole, 2-methylimidazole, 2-phenyl-2-imidazoline, and 1,2-dimethylimidazole. In addition, different size of silver particles and hybrid silver particles were used for the electrical resistivity and thermal conductivity of silver adhesives. Differential scanning calorimetric (DSC) measured conversion of silver adhesives based on different types and contents of the curing agents and accelerants under heating. The silver particles' distribution of silver adhesive also affected electrical resistance, as proved by scanning electronic microscopy (SEM) and four-point probe. The obtained results showed that the silver adhesive containing an 100 wt % of epoxy resin mixed with 85 wt % of hexahydrophthalic anhydride, 1.0 wt % (weight of epoxy resin) of 2-ethyl-4-methyl-1H-imidazole-1-propanenitrile, and 80 wt % (weight of epoxy resin) of hybrid silver particles (40 wt % 15 m and 40 wt % 1.25 m) was perfect, having the lowest electrical resistivity at 1.11 x 10(-4) Omega . cm and good thermal conductivity at 3.2 W/mK. (c) 2016 Wiley Periodicals, Inc.
机译：这项研究调查了用于发光二极管（LED）器件的银胶的制备方法，该银胶是由银颗粒组成的芯片附着材料，在环氧树脂，固化剂和促进剂上可在150摄氏度下完成30分钟的完全固化。对于环氧树脂，本研究使用3,4-环氧环己基-甲基3,4-环氧环己烷羧酸酯与不同类型的酸酐固化剂（例如4-甲基环己烷-1，2-二羧酸酐和六氢邻苯二甲酸酐）以及咪唑促进剂混合使用作为2-乙基-4-甲基-1H-咪唑-1-丙腈，2-苯基咪唑，2-甲基咪唑，2-苯基-2-咪唑啉和1,2-二甲基咪唑。另外，将不同尺寸的银颗粒和杂化银颗粒用于银粘合剂的电阻率和导热率。差示扫描量热法（DSC）根据加热下固化剂和促进剂的不同类型和含量，测量了银粘合剂的转化率。扫描电子显微镜（SEM）和四点探针证明，银胶粘剂中银颗粒的分布也会影响电阻。所得结果表明，该银粘合剂含有100重量％的环氧树脂和85重量％的六氢邻苯二甲酸酐，1.0重量％（环氧树脂的重量）的2-乙基-4-甲基-1H-咪唑-1-丙烷腈。并且，混合银颗粒（40 wt％15 m和40 wt％1.25 m）的80 wt％（环氧树脂的重量）是完美的，在1.11 x 10（-4）Omega处具有最低的电阻率。 cm和良好的导热性， 3.2 W / m K 。 （c）2016年威利期刊有限公司

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