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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Sequential interfacial intermetallic compound formation of Cu_6Sn_5 and Ni_3Sn_4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process
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Sequential interfacial intermetallic compound formation of Cu_6Sn_5 and Ni_3Sn_4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process

机译：在回流过程中，Sn-Ag-Cu焊料和ENEPIG衬底之间依次形成Cu_6Sn_5和Ni_3Sn_4的界面金属间化合物

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摘要

The interfacial reactions between Sn-3.0 wt.% Ag-0.5 wt.% Cu solder and an electroless nickel-electroless palladium-immersion gold (ENEPIG) substrate were investigated. After initial reflowing, discontinuous polygonal-shape (Cu,Ni)_6Sn_5 intermetallic compounds (IMCs) formed at the interface. During reflowing for up to 60 min, the interfacial IMCs were sequentially changed in the following order: discontinuous (Cu,Ni)_6Sn_5, (Cu,Ni)_6Sn_5 and (Ni,Cu)_3Sn_4, and embedded (Cu,Ni)_6Sn_5 in (Ni,Cu)_3Sn_4. The interfacial product variation resulted from the preferential consumption of Cu atoms within the solder and continuous Ni diffusion from the Ni(P) layer.
机译：研究了Sn-3.0 wt。％Ag-0.5 wt。％Cu焊料与化学镀镍-化学镀钯金（ENEPIG）基板之间的界面反应。初始回流后，在界面处形成了不连续的多边形（Cu，Ni）_6Sn_5金属间化合物（IMC）。在长达60分钟的回流期间，按以下顺序依次更改界面IMC：不连续的（Cu，Ni）_6Sn_5，（Cu，Ni）_6Sn_5和（Ni，Cu）_3Sn_4，并嵌入（Cu，Ni）_6Sn_5 （Ni，Cu）_3Sn_4。界面产物的变化是由于焊料中铜原子的优先消耗和Ni（P）层中Ni的连续扩散所致。

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