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首页> 外文期刊>Journal of Materials Processing Technology >Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad
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Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad

机译：在Cu焊盘上使用Sn-Ag Cu焊料进行激光焊接期间，界面处金属间化合物层的形成和生长

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摘要

The formation and growth of an intermetallic compound (IMC) layer at the Sn-Ag-Cu solder/Cu interface after laser soldering and during isothermal aging were investigated to elucidate the basic characteristics of the laser soldering process. The impact reliability of joints soldered using the laser process was also examined. It was found that, in the as-soldered condition, a relatively thin IMC layer is formed at the interface of the joints soldered by the laser process. The impact reliability of the joints soldered by the laser process at 20W for 40s was superior to that of the joints soldered by the conventional reflow process.
机译：研究了Sn-Ag-Cu焊料/ Cu界面在激光焊接后和等温时效期间金属间化合物（IMC）层的形成和生长，以阐明激光焊接过程的基本特征。还检查了使用激光工艺焊接的接头的冲击可靠性。发现在焊接状态下，在通过激光工艺焊接的接头的界面处形成了相对薄的IMC层。通过激光在20W的功率下焊接40s所焊接的接头的冲击可靠性优于通过传统回流工艺焊接的接头。

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