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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw
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Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw

机译：通过固定磨料锯的KDP晶体切片中的热和切割力引起的耦合应力

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摘要

KDP (KH2PO4) crystal is an important functional crystalline material that can be used in the area of laser frequency conversion. As the first process of machining, the slicing process of the KDP crystal is of vital importance to the yield rate of wafers. While the KDP crystal often cracks in the slicing process by the traditional method of band saw because of its properties of high brittleness, low strength, and high thermal sensitivity, the cracks may lead to waste of the whole KDP crystal and should be avoided. Fixed abrasive wire saw slicing is considered a preferred method for KDP crystal slicing due to its advantage of low sling stress. In this paper, a finite element model in fixed abrasive wire saw slicing of the KDP crystal is established with respect to distributed slicing force and thermal stress. Distribution of slicing force and heat around the kerf area is deduced and applied to the finite element model. Based on the model, temperature field and stress field of the KDP crystal in the slicing process is obtained. The maximum principle stress caused by slicing force, thermal stress, and coupling of the slicing force and thermal stress is obtained. The maximum principle stress of different slicing parameters is analyzed; function equation between the maximum principle stress and slicing parameter is obtained by the least squares method. The critical slicing parameter at which cracks would not occur in the slicing is obtained. The simulation results in this paper are useful to avoid cracking in KDP crystal slicing with fixed abrasive wire saw.
机译：KDP（KH2PO4）晶体是一种重要的功能性晶体材料，可用于激光频率转换面积。作为加工的第一过程，KDP晶体的切片过程对晶片的产量率至关重要。虽然KDP晶体经常通过传统的带锯的切片过程中的裂缝，但由于其高脆性，低强度和高热灵敏度的性质，裂缝可能导致整个KDP晶体浪费并且应避免。固定磨料线锯切片被认为是由于其低吊带应力的优点而被认为是KDP晶体切片的优选方法。本文相对于分布式切片力和热应力建立了KDP晶体的固定磨削线锯切割的有限元模型。推导出切片力和围绕Kerf区域周围的分布并施加到有限元模型。基于切片过程中KDP晶体的模型，温度场和应力场。获得由切片力，热应力和切片力和热应力的耦合引起的最大原理应力。分析了不同切片参数的最大原理应力;最大原理应力和切片参数之间的功能方程由最小二乘法获得。获得了裂缝在切片中不会发生裂缝的临界切片参数。本文的仿真结果可用于避免用固定磨料锯的KDP晶体切片裂缝。

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