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Curing kinetics and mechanical properties of fast curing epoxy resins with isophorone diamine and N-(3-aminopropyl)-imidazole

机译:用异佛酮二胺和N-(3-氨基丙基)咪唑的快速固化环氧树脂的固化动力学和力学性能

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Fast curing epoxy resins were prepared by the reactions of diglycidyl ether of bisphenol A with isophorone diamine (IPD) and N-(3-aminopropyl)-imidazole (API), and their curing kinetics and mechanical properties influenced by IPD content were also investigated. The analysis of curing kinetics was based on the nonisothermal differential scanning calorimetry (DSC) data with the typical Kissinger, Ozawa, and Flynn-Wall-Ozawa models, respectively. The glass-transition temperature was also measured by the same technique. Additionally, the mechanical properties including flexural, impact, and tensile performances were tested, and the curing time was estimated by isothermal DSC. The degree of cure (alpha) dependency of activation energy (E-a) revealed the complexity of curing reaction. Detailed analysis of the curing kinetics at the molecular level indicated that the dependence of E-a on the alpha was a combined effect of addition reaction, autocatalytic reaction, viscosity, and steric hindrance. From the nonisothermal curves, the curing reaction mechanism could be proposed according to the increasingly obvious low temperature peaks generated by the addition reaction of epoxy group with the primary amines in API and IPD molecules. Using the preferred resin formulation, the resin system could be cured within 10 min at 120 degrees C with a relatively good mechanical performance. (c) 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47950.
机译:通过双酚A的双酚A与异佛酮二胺(IPD)和N-(3-氨基丙基) - 咪唑(API)反应制备快速固化环氧树脂,并研究其固化动力学和受IPD含量影响的机械性能。固化动力学的分析基于典型的基辛格,Ozawa和Flyn-Wall-Ozawa模型的非热差分扫描量热法(DSC)数据。还通过相同的技术测量玻璃化转变温度。另外,测试包括弯曲,撞击和拉伸性能的机械性能,并通过等温DSC估算固化时间。激活能量(E-A)的固化程度(α)依赖性揭示了固化反应的复杂性。对分子水平的固化动力学进行详细分析表明E-A对α的依赖性是加成反应,自催化反应,粘度和空间障碍的综合作用。从非等温曲线,可以根据通过在API和IPD分子中的伯胺的环氧基的加成反应产生的越来越明显的低温峰来提出固化反应机理。使用优选的树脂制剂,树脂体系可以在120℃下以相对良好的机械性能在10分钟内固化。 (c)2019 Wiley期刊,Inc.J.Phill。聚合物。 SCI。 2019,136,47950。

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