Ag-Se-Sn phase diagrams and Sn/Ag2Se interfacial reactions

Ramakrishnan Anbalagan; Chen Sinn-wen; Hutabalian Yohanes

首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Ag-Se-Sn phase diagrams and Sn/Ag2Se interfacial reactions

【24h】

Ag-Se-Sn phase diagrams and Sn/Ag2Se interfacial reactions

机译：AG-SE-SN相图和SN / AG2SE界面反应

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

Ag2Se is a prominent thermoelectric material and Sn is a primary constituent element of joining alloys. The interfacial reactions in the Sn/Ag2Se couples at 550 degrees C, 400 degrees C and 250 degrees C are examined for various reaction times between 5 and 120 min. To provide fundamental understanding, the phase equilibria isothermal sections of the ternary Ag-Se-Sn system are also determined. The respective isothermal sections are proposed based on limited ternary experimental results, Ag-Se-Sn phase equilibria studies and the phase diagrams of its constituent binary systems. The reaction layers are parallel to Ag2Se substrate and grow thicker with longer reaction times and higher temperatures. Besides a thin SeSn phase layer, a thick ternary Ag8Se6Sn phase is observed in the reacted Sn/Ag2Se couples at all temperatures. Ag concentration decreases in the reaction path from Ag2Se side towards molten Sn. Hence, excess Ag is dissolved in the liquid phase and epsilon-Ag3Sn phase precipitates when the couple is removed from the furnace. The determined reaction path is liquid/SeSn/Ag8Se6Sn/Ag2Se for all temperatures. (C) 2019 Elsevier B.V. All rights reserved.

机译：Ag2se是一个突出的热电材料，Sn是连接合金的主要成分元件。 SN / Ag2SE在550℃下耦合的界面反应，在550℃和250℃下进行400℃，在5-120分钟之间进行各种反应时间。为了提供基本的理解，还确定了三元AG-SES系统的相平衡等温部分。基于有限的三元实验结果，Ag-SE-Sn相平衡研究和其组成二元系统的相图提出了各等温部分。反应层平行于Ag2Se底物，并在更长的反应时间和更高的温度下生长较厚。除了薄的SESN相层之外，在所有温度下在反应的SN / Ag2SE夫妇中观察到厚三元Ag8Se6Sn相。 Ag浓度从Ag2se侧朝向熔融Sn的反应路径降低。因此，当耦合从炉中除去时，将过量的Ag溶解在液相和epsilon-Ag3Sn相沉淀物中。确定的反应路径为所有温度为液体/ sesn / ag8se6sn / ag2se。（c）2019 Elsevier B.v.保留所有权利。

著录项

来源
《Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics》 |2020年第2020期|共10页
作者
Ramakrishnan Anbalagan; Chen Sinn-wen; Hutabalian Yohanes;
展开▼
作者单位

Natl Tsing Hua Univ Dept Chem Engn Hsinchu Taiwan;

Natl Tsing Hua Univ Dept Chem Engn Hsinchu Taiwan;

Natl Tsing Hua Univ Dept Chem Engn Hsinchu Taiwan;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类合金学与各种性质合金;金属材料;
关键词
Ag-Se-Sn; Interfacial reactions; Phase diagrams;

机译：AG-SE-SN;界面反应;相图;

相似文献

外文文献
中文文献
专利

1. Ag-Se-Sn phase diagrams and Sn/Ag2Se interfacial reactions [J] . Ramakrishnan Anbalagan, Chen Sinn-wen, Hutabalian Yohanes Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2020,第期

机译：AG-SE-SN相图和SN / AG2SE界面反应
2. Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples [J] . Yee-Wen Yen, Chien-Chung Jao, Hsien-Ming Hsiao, Journal of Electronic Materials . 2007,第2期

机译：Sn-Cu-Au三元系和Ag-Sn-Cu-Au四元系的相平衡及Sn-Cu / Au对中的界面反应的研究
3. Interfacial Reactions in the Sn-(Ag)/(Ni,V)Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-Rich Corner [J] . CHIH-CHI CHEN, SINN-WEN CHEN, CHING-YA KAO Journal of Electronic Materials . 2006,第5期

机译：Sn-（Ag）/（Ni，V）偶合中的界面反应和Sn-Ni-V系统在Sn-Rich角处的相平衡
4. Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications [C] . Yang T.L., Shih W.L., Yu J.J., IEEE Electronic Components and Technology Conference . 2014

机译：空间约束下Cu与Sn，Sn-Ag，Sn-Bi，Sn-Zn焊料之间的界面反应，用于3D IC微接头应用
5. Interfacial reaction of Sn-based solder joint in the package system. [D] . Gu, Huandi. 2014

机译：封装系统中锡基焊点的界面反应。
6. The Cu-Li-Sn Phase Diagram: Isopleths Liquidus Projection and Reaction Scheme [O] . Siegfried Fürtauer, Hans Flandorfer -1

机译：Cu-Li-Sn相图：同位素液相线投影和反应方案
7. The Application of Phase Diagram for Interfacial Reactions in Electronic Packaging [O] . Yee Wen Yen 2018

机译：相图在电子包装中界面反应的应用
8. Survey of literature, phase diagrams and data. Part 1, Pu-Ag to Pu-Sn. (Literaturbuebersicht, phasendiagramme und daten: Teil I, Pu-Ag bis Pu-Sn). [R] . H. Blank G. Brossmann M. Kemmerich F. Weitzenmiller 1991

机译：文献，相图和数据调查。第1部分，pu-ag到pu-sn。（Literaturbuebersicht，phasendiagramme und daten：Teil I，pu-ag bis pu-sn）。

Ag-Se-Sn phase diagrams and Sn/Ag2Se interfacial reactions

摘要

著录项

相似文献

相关主题

期刊订阅