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首页> 外文期刊>Journal of Electronic Materials >Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity
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Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

机译：用于混合的银薄片和银树枝状导电粘合剂，导电性增强

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Silver dendrites were prepared by a facile replacement reaction between silver nitrate and zinc microparticles of 20 mu m in size. The influence of reactant molar ratio, reaction solution volume, silver nitrate concentration, and reaction time on the morphology of dendrites was investigated systematically. It was found that uniform tree-like silver structures are synthesized under the optimal conditions. Their structure can be described as a trunk, symmetrical branches, and leaves, which length scales of 5-10, 1-2 mu m, and 100-300 nm, respectively. All features were systematically characterized by scanning electron microscopy, transmission electron microscopy (TEM), high-resolution TEM, and x-ray powder diffraction. A hybrid fillers system using silver flakes and dendrites as electrically conductive adhesives (ECAs) exhibited excellent overall performance. This good conductivity can be attributed mainly to the synergy between the silver microflakes (5-20 mu m sized irregular sheet structures) and dendrites, allowing more conductive pathways to be formed between the fillers. In order to further optimize the overall electrical conductivity, various mixtures of silver microflakes and silver dendrites were tested in ECAs, with results indicating that the highest conductivity was shown when the amounts of silver microflakes, silver dendrites and the polymer matrix were 69.4 wt.% (20.82 vol.%), 0.6 wt.% (0.18 vol.%), and 30.0 wt.% (79.00 vol.%), respectively. The corresponding mass ratio of silver flakes to silver dendrites was 347:3. The resistivity of ECAs reached as low as 1.7 x 10(-4) Omega cm.
机译：通过硝酸银和20μm的锌微粒之间的容纳置换反应来制备银树枝状晶。系统地研究了反应物摩尔比，反应溶液体积，硝酸银浓度和反应时间对树突形态的影响。结果发现，在最佳条件下合成均匀的树状银结构。它们的结构可以被描述为树干，对称分支和叶子，分别为5-10,1-2μm和100-300nm的长度。通过扫描电子显微镜，透射电子显微镜（TEM），高分辨率TEM和X射线粉末衍射来系统地表征了所有特征。使用银薄片和树枝状物作为导电粘合剂（ECAS）的混合填料系统表现出优异的整体性能。这种良好的电导率主要是归因于银微薄片（5-20​​μm尺寸的不规则片材结构）和树枝状物之间的协同作用，允许在填料之间形成更多导电途径。为了进一步优化整体电导率，在ECAS中测试各种混合物和银树枝状物，结果表明当银微薄片，银树枝状物和聚合物基质的量为69.4重量％时显示出最高导电率。％ （20.82体积％），0.6重量％（0.18 Vol.％）和30.0重量％（79.00克拉％）。银薄片与银树枝状物的相应质量比为347：3。 ECA的电阻率达到1.7×10（-4）ωcm。

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