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首页> 外文期刊>Journal of Materials Science >Highly thermostable joint of a Cu/Ni-P plating/Sn-0.7Cu solder added with Cu balls
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Highly thermostable joint of a Cu/Ni-P plating/Sn-0.7Cu solder added with Cu balls

机译：用Cu球添加Cu / Ni-P电镀/ SN-0.7CU焊料的高恒温接头

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摘要

Solder joint reliability in power modules is one of the most important issues for hybrid, electric, and fuel cell vehicles; these modules must have highly reliable solder joints, i.e., they must be highly thermostable at temperatures over 175 A degrees C in the future. The soldering surfaces in power modules are often finished with electroless Ni-P plating. Thus, for Cu/Ni-P plating/Sn-0.7Cu joints, it is necessary to suppress Ni diffusion into the solder. Ni diffusion can be suppressed in the presence of a continuous Cu6Sn5 intermetallic compound (IMC) layer at a Ni-P plating/solder interface. To form this IMC, we investigated the composite Sn-0.7Cu solder added with Cu balls. It was confirmed that the addition of 2.5 wt% Cu balls formed a continuous (Cu, Ni)(6)Sn-5 IMC layer between the solder and the Ni-P plating. It is concluded that the IMC layer works well as a Ni diffusion barrier in multiple reflow tests, of which the peak temperature was 330 A degrees C, and in a high-temperature storage test at 200 A degrees C for 1000 h.
机译：电源模块的焊点可靠性是混合，电动和燃料电池车辆最重要的问题之一;这些模块必须具有高度可靠的焊点，即，在未来在175岁的温度下，它们必须高温高稳定。电源模块中的焊接表面通常用无电镀Ni-P电镀完成。因此，对于Cu / Ni-P电镀/ Sn-0.7Cu接头，必须将Ni扩散抑制到焊料中。在Ni-P电镀/焊料界面处的连续CU6SN5金属间化合物（IMC）层的存在下，可以抑制Ni扩散。为了形成该IMC，我们研究了加入Cu球的复合Sn-0.7Cu焊料。确认添加2.5wt％Cu球在焊料和Ni-P电镀之间形成连续（Cu，Ni）（6）Sn-5 IMC层。结论是，IMC层作为多重回流试验中的Ni扩散屏障，其中峰值温度为330℃，在200℃下的高温储存试验中为1000小时。

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