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Synergetic enhancement of thermal conductivity in the silica-coated boron nitride (SiO2@BN)/polymethyl methacrylate (PMMA) composites

机译:在二氧化硅涂覆的氮化硼(SiO 2 @ BN)/聚甲基丙烯酸甲酯(PMMA)复合材料中的热导率的协同增强

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摘要

High thermal conductivity polymer composites have increased application in modern electronics. To achieve high thermal conductivity at relatively low filler content, two critical approach are used: surface modification of the filler and construction of thermal conductive network in polymer composites. This article provided a new simple and feasible method to modify h-BN consisting of physical absorption of polyvinylpyrrolidone (PVP) and hydrolysis of tetraethyl orthosilicate (TEOS). Then, SiO2@BN/PMMA composites were fabricated via solution-mixing and hot compression. The surface modification of BN enhanced the interface interaction between adjacent BN, which led to reduced thermal resistance and phonon scattering. The solution-mixing and hot compression process ensured the formation of thermal conductive pathway at the same time. The highest thermal conductivity of 40 vol% SiO2@BN/PMMA composite reached 5.583W /m K, which exhibited 3292% and 200% enhancement compared with the pure PMMA and melt-mixing BN/PMMA composites, respectively.
机译:高导热性聚合物复合材料在现代电子产品中增加了应用。为了在相对低的填充物含量下实现高导热率,使用了两种临界方法:聚合物复合材料中的填充物的表面改性和导热网络的构建。本文提供了一种改进H-BN的新简单和可行的方法,包括对聚乙烯吡咯烷酮(PVP)的物理吸收和四乙基硅酸盐(TEOS)的水解。然后,通过溶液混合和热压缩制造SiO2 @ BN / PMMA复合材料。 BN的表面改性增强了相邻BN之间的界面相互作用,其导致了耐热电阻和声子散射。溶液混合和热压缩过程确保同时形成导热途径。 40 Vol%SiO 2 @ BN / PMMA复合材料的最高导热率达到5.583W / m K,分别与纯PMMA和熔融混合BN / PMMA复合材料相比,表现出3292%和200%的增强。

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