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首页> 外文期刊>Advanced Powder Technology: The internation Journal of the Society of Powder Technology, Japan >The effect of copper granules on interfacial bonding and properties of the copper-graphite composite prepared by flake powder metallurgy
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The effect of copper granules on interfacial bonding and properties of the copper-graphite composite prepared by flake powder metallurgy

机译：铜颗粒对薄粉冶金制备的铜石墨复合物界面粘合及性能的影响

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摘要

The study evaluates the effect of introducing Cu granules and control milling on the microstructure, interfacial bonding and mechanical properties including sintered density, hardness, compressive strength, flexural strength and electrical conductivity of Copper-Graphite (Gr) composite synthesize by flake powder metallurgy (Flake PM). It develops the flake composite particles by control mechanical alloying (MA) which further laminates over the refine granules surface. This encapsulation facilitates the strong interfacial bonding among the composite constituents during sintering. Results highlight that the 10% Cu granules in Cu-10Gr composite exhibit excellent mechanical properties. It increases the relative density, hardness, compressive strength, and flexural strength by 4.19%, 28.23%, 98.31%, and 11.8% respectively. However, the electrical conductivity increases by 6.73% (%IACS) for 15% of Cu granules in the Cu-10Gr composite. The improvements in the results are the synergistic coordination of dispersion homogeneity, surface integrity, work hardening, and the superior interfacial adhesion between composite powder and Cu granules. (C) 2019 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.
机译：该研究评估将Cu颗粒和控制研磨引入微观结构，界面粘合和机械性能的效果，包括碳铜冶金合成铜 - 石墨（GR）复合材料的烧结密度，硬度，抗压强度，抗弯强度和电导率（剥落）下午）。它通过控制机械合金化（MA）通过对细细颗粒表面进行的控制机械合金化（MA）进行剥落复合颗粒。该包封促进复合成分在烧结过程中的强界面键合。结果突出显示Cu-10gr复合材料中10％Cu颗粒表现出优异的机械性能。它增加了相对密度，硬度，抗压强度和抗弯强度分别为4.19％，28.23％，98.31％和11.8％。然而，在Cu-10gr复合材料中，电导率增加了6.73％（％IACS），使15％的Cu颗粒中的Cu颗粒增加。结果的改进是分散均匀性，表面完整性，工作硬化和复合粉末和Cu颗粒之间的优异界面粘合的协同协调。 （c）2019年日本粉末技术学会。由elsevier b.v发表。和日本粉末科技会。版权所有。

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