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首页> 外文期刊>ECS Journal of Solid State Science and Technology >Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI
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Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI

机译：GLSI铜化学机械平坦化弱碱性浆料的研究

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摘要

Copper has been widely used as the most fundamental interconnection metal material for Gita-large scale integrated circuits(GLSI). During the chemical mechanical polishing (CMP) process, the stability of slurry is crucial to copper polishing performance. Through selecting the important factors of influence slurry such as pH, surfactant and pH-regulator, the weakly alkaline copper slurry was investigated in this paper. As the weakly alkaline slurry becomes very promising and stringent to fit for the requirement of integrated circuits development, and according to the investigation of removal rate results, pH 8.5-9.5 was selected as the appropriate pH range. Comparing with nonionic surfactant, anionic surfactant exhibited preferable performance for stability of silica sol such as ammonium dodecyl sulfate (ADS) due to its unique structure and charged property in weakly alkaline solution. Meanwhile, using tetraethylammonium hydroxide (TEAH) as pH-regulator instead of KOH, the copper slurry exhibited the stability for 7 days with H2O2. In order to examine the effectiveness of such copper slurry, the copper blanket and pattern wafer were polished by the slurry settling for 7 days. The pH-value, mean particle size, zeta potential and viscosity of the slurry fluctuated slightly with the aging time. And from the results of copper removal rate, roughness of copper blanket wafer and the step height values of pattern wafer it indicates that the weakly alkaline copper slurry has stability and which has a guiding significance to the development of microelectronics industry. (C) 2017 The Electrochemical Society. All rights reserved.
机译：铜已被广泛用作GITA大规模集成电路（GLSI）的最基本的互连金属材料。在化学机械抛光（CMP）过程中，浆料的稳定性对铜抛光性能至关重要。通过选择影响浆料的重要因素，如pH，表面活性剂和pH调节剂，本文研究了弱碱性铜浆。由于弱碱性浆料变得非常有前途和严格，以适应集成电路的需求，并且根据去除率结果的调查，选择pH 8.5-9.5作为适当的pH范围。与非离子表面活性剂相比，阴离子表面活性剂由于其独特的碱性溶液中的结构和带电性能而表现出硅胶稳定性的优选性能，例如硫酸二甲酯（ADS）。同时，使用氢氧化铵（茶）作为pH调节剂而不是KOH，铜浆料与H 2 O 2表现出7天的稳定性。为了检查这种铜浆料的有效性，通过浆料沉降抛光铜橡皮布和图案晶片7天。浆料的pH值，平均粒度，ζ电位和粘度略微波动，随着老化时间略微波动。从铜去除速率的结果，铜橡皮布晶片的粗糙度和图案晶片的阶梯高度值表明弱碱性铜浆具有稳定性并且对微电子工业的发展具有指导意义。 （c）2017年电化学协会。版权所有。

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    Yao Caihong; Niu Xinhuan; Wang Chenwei; Liu Yuling; Jiang Zichao; Wang Yan; Tian Shengjun;

  • 作者单位

    Hebei Univ Technol Sch Elect &

    Informat Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Elect &

    Informat Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Elect &

    Informat Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Elect &

    Informat Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Elect &

    Informat Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Elect &

    Informat Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Elect &

    Informat Engn Tianjin 300130 Peoples R China;

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  • 中图分类 电化学工业;
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