Fracture toughness of freestanding copper films with a thickness of 39?nm

Toshiyuki Kondo; Kazuki Hiramine; Hiroyuki Hirakata; Kohji Minoshima

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Fracture toughness of freestanding copper films with a thickness of 39?nm

机译：独立式铜膜的骨折韧性，厚度为39Ω·纳米

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In situ field emission scanning electron microscope (FESEM) fracture toughness experiments on 39-nm-thick freestanding copper (Cu) films were conducted. We developed methods for fabricating and testing the fracture toughness of ultrathin freestanding metallic film specimens. Although 39-nm-thick Cu films showed lower critical crack tip opening displacement (CTOD) than 100–2600-nm-thick films, both films had similar critical CTODs when normalized by their film thickness. This independence of normalized CTOD on film thickness indicates that geometric similarity of local fracture morphologies exists in films with a thickness of the order of 10?nm. Crack initiation in ultrathin films was accompanied by ductile fracture.

机译：原位场发射扫描电子显微镜（FeSEM）进行39-NM厚的独立铜（Cu）膜的断裂韧性实验。我们开发了制造和测试超薄自由型金属薄膜样本的断裂韧性的方法。尽管39-nm厚的Cu膜显示出低于100-2600nm厚的薄膜的临界裂缝尖端开口位移（CTOD），但是当通过它们的膜厚度归一化时，两种薄膜在归一化时具有类似的关键CTOD。这种归一化CTOD对膜厚度的这种独立性表明局部骨折形态的几何相似性存在于厚度为10Ω·Nm的薄膜中。超薄薄膜的裂纹引发伴有延性骨折。

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来源
《Engineering Fracture Mechanics》 |2018年第2018期|共11页
作者
Toshiyuki Kondo; Kazuki Hiramine; Hiroyuki Hirakata; Kohji Minoshima;
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作者单位

Department of Mechanical Engineering Osaka University;

Department of Mechanical Engineering Osaka University;

Department of Mechanical Engineering and Science Kyoto University Kyoto-daigaku-Katsura;

Department of Mechanical Engineering Osaka University;

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原文格式 PDF
正文语种 eng
中图分类工程力学;
关键词
Thin film; Fracture toughness; Size effect; Copper;

机译：薄膜;断裂韧性;尺寸效果;铜;

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1. Fracture toughness of freestanding copper films with a thickness of 39?nm [J] . Toshiyuki Kondo, Kazuki Hiramine, Hiroyuki Hirakata, Engineering Fracture Mechanics . 2018,第期

机译：独立式铜膜的骨折韧性，厚度为39Ω·纳米
2. Fracture toughness of freestanding copper films with a thickness of 39?nm [J] . Toshiyuki Kondo, Kazuki Hiramine, Hiroyuki Hirakata, Engineering Fracture Mechanics . 2018,第期

机译：独立式铜膜的骨折韧性，厚度为39Ω·纳米
3. Direct observation of the thickness effect on critical crack tip opening displacement in freestanding copper submicron-films by in situ electron microscopy fracture toughness testing [J] . Hirakata Hiroyuki, Takeda Yuki, Kondo Toshiyuki, International Journal of Fracture . 2015,第2期

机译：通过原位电子显微镜断裂韧性测试直接观察厚度对独立式亚微米铜膜临界裂纹尖端开口位移的影响
4. A New Methodology to Investigate Fracture Toughness of Freestanding Thin Solid Films [C] . H. D. Espinosa, B. Peng Proceedings of the 2003 SEM annual conference amp; exposition on experimental and applied mechanics . 2003

机译：研究独立式固体薄膜断裂韧性的新方法
5. An experimental assessment of the size effects on the strength and ductility of freestanding copper films under macroscopically homogenous deformation. [D] . Chauhan, Shakti Singh. 2008

机译：宏观均匀变形下尺寸对独立铜膜强度和延展性影响的实验评估。
6. The Thickness Effect of PSF Nanofibrous Mat on Fracture Toughness of Carbon/Epoxy Laminates [O] . Hamed Saghafi, Ali Nikbakht, Reza Mohammadi, 2021

机译：PSF纳米纤维对碳/环氧层压裂缝骨折韧性的厚度效应
7. Scaling of the fracture toughness of freestanding metallic thin films with the yield strength [O] . Eva I. Preiß, Florentina Gannott, Mathias Göken, 2018

机译：具有屈服强度的独立金属薄膜断裂韧性的缩放
8. Fracture Toughness Comparison between a Semielliptical Surface Crack in a 4PBPlate and a Through-Thickness Crack in a 3PB Fracture Toughness Test Specimen [R] . Nevalainen, M. J. 1997

机译：4pBplate中半椭圆表面裂纹与3pB断裂韧性试样中贯穿厚度裂纹的断裂韧性比较

Fracture toughness of freestanding copper films with a thickness of 39?nm

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