机译:基于硅酸钙的密封剂去除方案和酸蚀刻时间点对牙本质粘接界面的影响
Department of Restorative DentistryAraraquara Dental School Univ Estadual Paulista (UNESP)Araraquara Brazil;
Department of Restorative DentistryAraraquara Dental School Univ Estadual Paulista (UNESP)Araraquara Brazil;
Department of Restorative DentistryAraraquara Dental School Univ Estadual Paulista (UNESP)Araraquara Brazil;
Department of Restorative DentistryAraraquara Dental School Univ Estadual Paulista (UNESP)Araraquara Brazil;
Department of Restorative DentistryRibeir?o Preto Dental School S?o Paulo University (USP)Ribeir?o Preto Brazil;
Department of Restorative DentistryAraraquara Dental School Univ Estadual Paulista (UNESP)Araraquara Brazil;
dentin; endodontics; image analysis; scanning electron microscopy;
机译:基于硅酸钙的密封剂去除方案和酸蚀刻时间点对牙本质粘接界面的影响
机译:掺有生物活性硅酸钙基微填充剂的实验性蚀刻和冲洗粘合剂,可产生治疗性的树脂-牙本质界面
机译:减少酸蚀刻持续时间对钙硅酸钙水泥抗压强度和粘合性的影响
机译:煤粉煤灰衍生的介孔钙 - 硅酸盐材料(MCSM),用于从酸性溶液中有效去除CD(II),Cr(III),Ni(II)和Pb(II)
机译:切除对硅酸三钙封闭剂阻塞的牙根封闭剂-牙本质界面的影响:共聚焦激光扫描显微镜和印度墨水渗透性的体外试验研究
机译:预蚀刻与自蚀刻胶粘剂系统的微渗漏和树脂与牙本质的界面形态
机译:两步自蚀刻粘合系统界面的牙本质键合性能和酸性基础性的评价