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首页> 外文期刊>Nanoscience and Nanotechnology Letters >Non Destructive Thickness Analysis in Triple Ni/Cr Thin Film Using Electrolytic Etching and Potential Determination Process
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Non Destructive Thickness Analysis in Triple Ni/Cr Thin Film Using Electrolytic Etching and Potential Determination Process

机译：采用电解蚀刻和电位测定工艺三重NI / Cr薄膜的非破坏性厚度分析

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摘要

Ni/Cr plating is one of the most commonly used platings for decorative purposes. Cr is a metal with excellent corrosion resistance. In the case of decorative Cr, plating with a thickness of less than 0.5 mu m is generally performed, so accurate chromium plating thickness analysis method is needed in rack plating. In this study, the etching characteristics of Cr and Ni were analyzed by electrochemical method. The electrode potential was maintained during the etching of specific coating layer and then the etching time directly related with coating thickness. The Ni/Cr plating thickness was analyzed by electrolytic etching method and consequently the Cr thickness distribution of rack plated specimens was determined.
机译：Ni / Cr电镀是用于装饰目的最常用的夹具之一。 CR是一种具有优异耐腐蚀性的金属。 在装饰性CR的情况下，通常进行厚度小于0.5μm的电镀，因此在齿条电镀中需要精确的镀铬厚度分析方法。 在该研究中，通过电化学方法分析Cr和Ni的蚀刻特性。 在蚀刻特定涂层期间保持电极电位，然后与涂层厚度直接相关的蚀刻时间。 通过电解蚀刻方法分析Ni / Cr电镀厚度，因此确定了齿条镀架样本的Cr厚度分布。

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