Convection vs vapour phase reflow in LED and BGA assembly

Dziurdzia Barbara; Sobolewski Maciej; Mikolajek Janusz

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Convection vs vapour phase reflow in LED and BGA assembly

机译：LED和BGA组件中的对流VS气相回流

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Purpose The aim of this paper is to evaluate using statistical methods how two soldering techniques - the convection reflow and vapour phase reflow with vacuum - influence reduction of voids in lead-free solder joints under Light Emitted Diodes (LEDs) and Ball Grid Arrays (BGAs).

机译：目的本文的目的是使用统计方法评估两种焊接技术 - 对流回流和气相回流具有真空 - 在发光二极管（LED）和球栅阵列下的无铅焊点中的空隙减少（BGAS））。

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来源
《Soldering & Surface Mount Technology》 |2018年第2期|共13页
作者
Dziurdzia Barbara; Sobolewski Maciej; Mikolajek Janusz;
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作者单位

AGH Univ Sci &

Technol Fac Comp Sci Elect &

Telecommun Krakow Poland;

Fideltronik SA Krakow Poland;

Fideltron Poland Ltd Sucha Beskidzka Poland;

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原文格式 PDF
正文语种 eng
中图分类焊接一般性问题;
关键词
Coverage; Convection reflow; Cree LEDs; Vacuum; Vapour phase reflow;

机译：覆盖范围;对流回流;CREE LED;真空;气相回流;

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专利

1. Convection vs vapour phase reflow in LED and BGA assembly [J] . Dziurdzia Barbara, Sobolewski Maciej, Mikolajek Janusz Soldering & Surface Mount Technology . 2018,第2期

机译：LED和BGA组件中的对流VS气相回流
2. Vapor phase vs. convection reflow in RoHS-compliant assembly [J] . Dan Coada Global SMT & Packaging: European Edition (Surface Mount Technology) . 2009,第4期

机译：符合RoHS的组件中的汽相与对流回流
3. Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection [J] . Young-Seok SON, Jee-Young SHIN JSME International Journal. Series B, Fluids and Thermal Engineering . 2005,第4期

机译：空气注入烤箱中强制对流红外回流焊过程中电子组件的热响应
4. Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and Assembly Process Sensitivities [C] . Quyen Chu, Girish Wable, Anthony Babasa, IPC apex expo . 2009

机译：低银BGA组装第一阶段-回流注意事项和共同的同质性第三份报告：四种低银球体合金的比较和组装工艺的敏感性
5. Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage. [D] . Tan, Wei. 2008

机译：对流回流投影云纹翘曲测量系统的开发，以及受翘曲影响的电路板组件上焊料凸点可靠性的预测。
6. Response of rat lung to inhaled vapour phase constituents (VP) of tobacco smoke alone or in conjunction with smoke condensate or fractions of smoke condensate given by intratracheal instillation. [O] . B. R. Davis, J. K. Whitehead, M. E. Gill, 1975

机译：单独或与气管内滴注给予的烟气冷凝物或烟气冷凝物馏分一起大鼠肺对烟气的吸入气相成分（VP）的响应。
7. On the Behavior of Vapour Bubbles in Subcooled Boiling with Forced Convection : Part 1, Generating Periods and Life Times of Vapour Bubbles [O] . Takashi SATO, Hirohisa MATSUMURA, Mizuo OKADA 1971

机译：论强制对流沸腾沸腾蒸汽气泡的行为：第1部分，产生期间和蒸汽气泡的生命时间
8. Vapour Phase Epitaxial Indirect Band Gap GaAs1-xPx LEDs on GaP-Substrate [R] . Scharzmichel, K. 1980

机译：Gap衬底上的气相外延间接带隙Gaas1-xpx LED

Convection vs vapour phase reflow in LED and BGA assembly

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