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首页> 外文期刊>PV Magazine >ALD enabler: DK Electronic Materials DK92X Silver Paste series
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ALD enabler: DK Electronic Materials DK92X Silver Paste series

机译：ALD Enabler：DK电子材料DK92X银粘贴系列

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摘要

The DK92 series of high-efficiency silver pastes developed by Chinese manufacturer DK Electronic Materials (DKEM) aims to address the balance between lower firing temperatures needed for high-efficiency technologies such as PERC and ensuring a good contact window with reliable adhesion and high-speed printability. The series features a PERC paste (DK92 A/B) which DKEM says can achieve firing temperatures of 10 to 30°C, and offers enhanced adhesion on both monocrystal-line and black silicon treated multi, and continues with 'the trend of lower silver consumption.' The paste achieves fine line printing down to less than 24 microns at speeds of more than 350 mm per second. Another in the series, DK92K is, according to the manufacturer, the first to be able to achieve acceptable contact performance with a stacked aluminum oxide/silicon nitride layer, making the mass production of the batch atomic layer deposition process for PERC possible, an innovation which could significantly lower production costs for PERC.
机译：中国制造商DK电子材料开发的DK92系列高效银浆（DKEM）旨在解决高效技术等高效技术所需的较低送温度和确保具有可靠附着力和高速的良好接触窗口之间的平衡可印刷性。该系列具有PERC粘贴（DK92 A / B），DKEM表示可以实现10至30°C的烧制温度，并在单晶线和黑色硅的多个多样性上提供增强的粘附性，并继续具有“较低银的趋势”消耗。'糊剂以每秒超过350毫米的速度降至小于24微米的细线。另一个在该系列中，DK92K的说明，根据制造商，首先能够通过堆叠的氧化铝/氮化硅层来实现可接受的接触性能，使得批量生产的批量生产以获得可创新的创新这可以显着降低PERC的生产成本。

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