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首页> 外文期刊>Tribology International >Interplay between solution chemistry and mechanical activation in friction-induced material removal of silicon surface in aqueous solution
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Interplay between solution chemistry and mechanical activation in friction-induced material removal of silicon surface in aqueous solution

机译：水溶液中摩擦诱导材料去除摩擦诱导材料中硅表面的溶液化学和机械激活之间的相互作用

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摘要

Shear-induced chemical etching reactions of single-crystalline Si(100), Si(110), and Si(111) surfaces were studied in acidic, neutral, and basic aqueous solutions. Measuring the applied load dependence of substrate etching yield and analyzing the data with the mechanically-assisted thermal activation model, the critical activation volume and activation barrier were determined for mechanochemical etching of three crystallographic surfaces. The pH dependence of Si(110) etching is quite distinct from those of Si(100) and Si(111). The results suggested that the mechanochemical activation effect is larger for Si(100) and Si(111) than Si(110) which is chemically more reactive than the other two surfaces. The findings of this study may provide deeper insights for mechanistic understanding of the scanning probe microscopy based nanomanufacturing and chemical mechanical polishing processes.
机译：在酸性，中性和碱性水溶液中研究了单晶Si（100），Si（110）和Si（111）表面的剪切诱导的化学蚀刻反应。 测量衬底蚀刻产量并利用机械辅助热激活模型分析数据的施加负载依赖性，确定三个晶体表面的机械化蚀刻的临界激活体积和激活屏障。 Si（110）蚀刻的pH依赖性与Si（100）和Si（111）的pH依赖性相当不同。 结果表明，对于Si（100）和Si（111）的机械化活化效果比Si（110）更大，所述Si（110）比其他两个表面更具反应性。 本研究的结果可以为基于扫描探针显微镜的纳米制造和化学机械抛光方法的机械理解提供更深入的见解。

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